The temperature distribution and thermal stresses induced during processing of partial SOI structures
In this work, the numerical results on the distribution of thermal stress at the interface of partial SOI structures are presented.
Main Author: | Chen, Junming. |
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Other Authors: | Tan, Cher Ming |
Format: | Thesis |
Published: |
2008
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Subjects: | |
Online Access: | http://hdl.handle.net/10356/3771 |
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