The temperature distribution and thermal stresses induced during processing of partial SOI structures

The temperature distribution and thermal stresses induced during processing of partial SOI structures

In this work, the numerical results on the distribution of thermal stress at the interface of partial SOI structures are presented.

Dades bibliogràfiques
Autor principal:	Chen, Junming.
Altres autors:	Tan, Cher Ming
Format:	Thesis
Publicat:	2008
Matèries:	DRNTU::Engineering::Electrical and electronic engineering::Semiconductors
Accés en línia:	http://hdl.handle.net/10356/3771

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