High-speed programmable divider for wireless communication
The recent boom in the wireless communication market has attracted the interest of almost all electronic and communication companies worldwide. The evolution in microelectronics has played a dominant role in this by creating digital signal processing (DSP) chips with more and more computing power an...
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| Format: | Thesis |
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2008
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| Online Access: | http://hdl.handle.net/10356/3775 |
| _version_ | 1811686047147360256 |
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| author | Wu, Minjie. |
| author2 | Yeo, Kiat Seng |
| author_facet | Yeo, Kiat Seng Wu, Minjie. |
| author_sort | Wu, Minjie. |
| collection | NTU |
| description | The recent boom in the wireless communication market has attracted the interest of almost all electronic and communication companies worldwide. The evolution in microelectronics has played a dominant role in this by creating digital signal processing (DSP) chips with more and more computing power and combining the discrete components of the Radio Frequency (RF) front on a few Integrated Circuits (ICs) or even on a single die. In order to be compatible with the digital processing technology, a standard CMOS process without tuning, trimming or post-processing steps must be used. |
| first_indexed | 2024-10-01T04:54:12Z |
| format | Thesis |
| id | ntu-10356/3775 |
| institution | Nanyang Technological University |
| last_indexed | 2024-10-01T04:54:12Z |
| publishDate | 2008 |
| record_format | dspace |
| spelling | ntu-10356/37752023-07-04T15:50:34Z High-speed programmable divider for wireless communication Wu, Minjie. Yeo, Kiat Seng School of Electrical and Electronic Engineering DRNTU::Engineering::Electrical and electronic engineering::Wireless communication systems The recent boom in the wireless communication market has attracted the interest of almost all electronic and communication companies worldwide. The evolution in microelectronics has played a dominant role in this by creating digital signal processing (DSP) chips with more and more computing power and combining the discrete components of the Radio Frequency (RF) front on a few Integrated Circuits (ICs) or even on a single die. In order to be compatible with the digital processing technology, a standard CMOS process without tuning, trimming or post-processing steps must be used. Master of Science (Consumer Electronics) 2008-09-17T09:37:17Z 2008-09-17T09:37:17Z 2003 2003 Thesis http://hdl.handle.net/10356/3775 Nanyang Technological University application/pdf |
| spellingShingle | DRNTU::Engineering::Electrical and electronic engineering::Wireless communication systems Wu, Minjie. High-speed programmable divider for wireless communication |
| title | High-speed programmable divider for wireless communication |
| title_full | High-speed programmable divider for wireless communication |
| title_fullStr | High-speed programmable divider for wireless communication |
| title_full_unstemmed | High-speed programmable divider for wireless communication |
| title_short | High-speed programmable divider for wireless communication |
| title_sort | high speed programmable divider for wireless communication |
| topic | DRNTU::Engineering::Electrical and electronic engineering::Wireless communication systems |
| url | http://hdl.handle.net/10356/3775 |
| work_keys_str_mv | AT wuminjie highspeedprogrammabledividerforwirelesscommunication |