Interfacial studies of AlN-cordierite composite
The growing momentum within the electronic industry towards miniaturisation increased circuit densities, higher speeds and more powerful chips has cause the industry to look for better packaging material that have good thermal conductivity for adequate heat dissipation and low dielectric constant f...
| Main Author: | |
|---|---|
| Other Authors: | |
| Format: | Final Year Project (FYP) |
| Language: | English |
| Published: |
2010
|
| Subjects: | |
| Online Access: | http://hdl.handle.net/10356/38718 |