Thermal wavefront sensing fundamentals and applications

Thermal wavefront sensing combines the essences of two legendary sensing technologies: infrared imaging and the Shack-Hartmann wavefront sensor. First applied to visible metrology, the Shack-Hartmann wavefront sensor is now adapted into infrared thermography, opening up an unchartered territory of s...

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Bibliographic Details
Main Author: Ooi, Kelvin Jian Aun.
Other Authors: Ang Lay Kee Ricky
Format: Final Year Project (FYP)
Language:English
Published: 2010
Subjects:
Online Access:http://hdl.handle.net/10356/40240
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author Ooi, Kelvin Jian Aun.
author2 Ang Lay Kee Ricky
author_facet Ang Lay Kee Ricky
Ooi, Kelvin Jian Aun.
author_sort Ooi, Kelvin Jian Aun.
collection NTU
description Thermal wavefront sensing combines the essences of two legendary sensing technologies: infrared imaging and the Shack-Hartmann wavefront sensor. First applied to visible metrology, the Shack-Hartmann wavefront sensor is now adapted into infrared thermography, opening up an unchartered territory of science and technology. In its conception, the Shack-Hartmann extension is used to furnish extra spatial information: the propagating phase of thermal radiation, which enhanced the sensitivity in thermogram inspections. In this project, we investigated the fundamentals of thermal wavefront sensing to determine its analogy with visible wavefront sensing. Most of the results show inherent differences arising from the nature of thermal radiation which is broadband and diffuse. Some of the most prominent deviations from classical theories include diffraction effects from circular apertures and distortion of wavefronts due to diffusion and reflection effects. Nonetheless, in application thermal wavefront sensing shows promising results in its role of increasing the sensitivity of traditional thermographic defect inspection.
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spelling ntu-10356/402402023-07-07T17:27:07Z Thermal wavefront sensing fundamentals and applications Ooi, Kelvin Jian Aun. Ang Lay Kee Ricky School of Electrical and Electronic Engineering A*STAR SIMTech Dr. Zhao Liping DRNTU::Engineering::Electrical and electronic engineering::Electronic circuits Thermal wavefront sensing combines the essences of two legendary sensing technologies: infrared imaging and the Shack-Hartmann wavefront sensor. First applied to visible metrology, the Shack-Hartmann wavefront sensor is now adapted into infrared thermography, opening up an unchartered territory of science and technology. In its conception, the Shack-Hartmann extension is used to furnish extra spatial information: the propagating phase of thermal radiation, which enhanced the sensitivity in thermogram inspections. In this project, we investigated the fundamentals of thermal wavefront sensing to determine its analogy with visible wavefront sensing. Most of the results show inherent differences arising from the nature of thermal radiation which is broadband and diffuse. Some of the most prominent deviations from classical theories include diffraction effects from circular apertures and distortion of wavefronts due to diffusion and reflection effects. Nonetheless, in application thermal wavefront sensing shows promising results in its role of increasing the sensitivity of traditional thermographic defect inspection. Bachelor of Engineering 2010-06-14T02:23:10Z 2010-06-14T02:23:10Z 2010 2010 Final Year Project (FYP) http://hdl.handle.net/10356/40240 en Nanyang Technological University 125 p. application/pdf
spellingShingle DRNTU::Engineering::Electrical and electronic engineering::Electronic circuits
Ooi, Kelvin Jian Aun.
Thermal wavefront sensing fundamentals and applications
title Thermal wavefront sensing fundamentals and applications
title_full Thermal wavefront sensing fundamentals and applications
title_fullStr Thermal wavefront sensing fundamentals and applications
title_full_unstemmed Thermal wavefront sensing fundamentals and applications
title_short Thermal wavefront sensing fundamentals and applications
title_sort thermal wavefront sensing fundamentals and applications
topic DRNTU::Engineering::Electrical and electronic engineering::Electronic circuits
url http://hdl.handle.net/10356/40240
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