Polymer micro-fluidic devices: hot embossing of topas® using molds made of different materials

In the field of hot embossing of polymers for microfluidic devices, there is a lack of research into the performance of molds (dies) made of silicon, epoxy and TOPAS® COC grade 6017 (polymer of higher Tg) under identical experimental conditions, although all 3 materials have a set of promising advan...

詳細記述

書誌詳細
第一著者: Tang, Poh Seng.
その他の著者: Yue Chee Yoon
フォーマット: Final Year Project (FYP)
言語:English
出版事項: 2010
主題:
オンライン・アクセス:http://hdl.handle.net/10356/40447

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