Polymer micro-fluidic devices: hot embossing of topas® using molds made of different materials
In the field of hot embossing of polymers for microfluidic devices, there is a lack of research into the performance of molds (dies) made of silicon, epoxy and TOPAS® COC grade 6017 (polymer of higher Tg) under identical experimental conditions, although all 3 materials have a set of promising advan...
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| Formato: | Final Year Project (FYP) |
| Idioma: | English |
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2010
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| Acceso en liña: | http://hdl.handle.net/10356/40447 |