Design and application of precision automation for various semiconductor electronic packaging technologies
The ongoing miniaturization together with the increasing functionality of electronic devices, for example, mobile phones, camcorders, laptops, etc, has forced the semiconductor industry to develop, in ever-shorter cycle, smaller and thinner devices. The trend to CSPs (chip scale package) is becoming...
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| Format: | Thesis |
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2008
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| Online Access: | http://hdl.handle.net/10356/4128 |