Comparative study of modeling and experiments in precision crack off method
Thin slices of silicon are generated from the cast ingots in the solar or electronics industry to manufacture solar cells or Integrated Circuits (IC) respectively. Currently, wire sawing technique that is used in the industry takes 50% of total operational cost due to high kerf (material) loss and t...
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| Format: | Final Year Project (FYP) |
| Language: | English |
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2010
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| Online Access: | http://hdl.handle.net/10356/41622 |