Automation of Ball Grid Array (BGA) intergrated circuit manufacturing line
This thesis is an example of how we can adopt a strategy to be cost competent in launching new Integrated Circuit (IC) packages in the market. On e is in an environment wherein the cost of manufacturing is far above and beyond many South East – Asian coutries especially in terms of manpower, materia...
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| Format: | Thesis |
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2008
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| Online Access: | http://hdl.handle.net/10356/4262 |
| _version_ | 1826129510990348288 |
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| author | Joseph Erasmo A. Galang |
| author2 | Ho, Yeong Khing |
| author_facet | Ho, Yeong Khing Joseph Erasmo A. Galang |
| author_sort | Joseph Erasmo A. Galang |
| collection | NTU |
| description | This thesis is an example of how we can adopt a strategy to be cost competent in launching new Integrated Circuit (IC) packages in the market. On e is in an environment wherein the cost of manufacturing is far above and beyond many South East – Asian coutries especially in terms of manpower, material or cost of producing the product. |
| first_indexed | 2024-10-01T07:41:47Z |
| format | Thesis |
| id | ntu-10356/4262 |
| institution | Nanyang Technological University |
| last_indexed | 2024-10-01T07:41:47Z |
| publishDate | 2008 |
| record_format | dspace |
| spelling | ntu-10356/42622023-07-04T15:12:31Z Automation of Ball Grid Array (BGA) intergrated circuit manufacturing line Joseph Erasmo A. Galang Ho, Yeong Khing School of Electrical and Electronic Engineering DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging This thesis is an example of how we can adopt a strategy to be cost competent in launching new Integrated Circuit (IC) packages in the market. On e is in an environment wherein the cost of manufacturing is far above and beyond many South East – Asian coutries especially in terms of manpower, material or cost of producing the product. Master of Science (Computer Control and Automation) 2008-09-17T09:47:56Z 2008-09-17T09:47:56Z 2003 2003 Thesis http://hdl.handle.net/10356/4262 Nanyang Technological University application/pdf |
| spellingShingle | DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging Joseph Erasmo A. Galang Automation of Ball Grid Array (BGA) intergrated circuit manufacturing line |
| title | Automation of Ball Grid Array (BGA) intergrated circuit manufacturing line |
| title_full | Automation of Ball Grid Array (BGA) intergrated circuit manufacturing line |
| title_fullStr | Automation of Ball Grid Array (BGA) intergrated circuit manufacturing line |
| title_full_unstemmed | Automation of Ball Grid Array (BGA) intergrated circuit manufacturing line |
| title_short | Automation of Ball Grid Array (BGA) intergrated circuit manufacturing line |
| title_sort | automation of ball grid array bga intergrated circuit manufacturing line |
| topic | DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging |
| url | http://hdl.handle.net/10356/4262 |
| work_keys_str_mv | AT josepherasmoagalang automationofballgridarraybgaintergratedcircuitmanufacturingline |