FE simulation of thin film mechanical sensitivity for MEMS applications

In this report, the use of corrugated diaphragm for microphone sensing is discussed. The corrugated diaphragm is a type of thin film MEMS device that is actuated by an external pressure. The diaphragm’s height is studied in this project to determine the optimum mechanical sensitivity, natural freque...

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Bibliographic Details
Main Author: Zhang, Xin Gang
Other Authors: Lin Rongming
Format: Final Year Project (FYP)
Language:English
Published: 2011
Subjects:
Online Access:http://hdl.handle.net/10356/42866
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author Zhang, Xin Gang
author2 Lin Rongming
author_facet Lin Rongming
Zhang, Xin Gang
author_sort Zhang, Xin Gang
collection NTU
description In this report, the use of corrugated diaphragm for microphone sensing is discussed. The corrugated diaphragm is a type of thin film MEMS device that is actuated by an external pressure. The diaphragm’s height is studied in this project to determine the optimum mechanical sensitivity, natural frequency and initial stress loading. The use of ANSYS Finite Element Analysis software is to obtain the necessary values for study instead of actual experiment which is costly and time consuming. The content of this report on ANSYS application, such as modeling and simulation, including detailed procedures taken to obtain the necessary results serves to provide a guide for further research to be carried out. Finally, the comparisons were made between six case studies and the chosen design is concluded based on the criterion of microphone sensing.
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spelling ntu-10356/428662023-03-04T18:59:42Z FE simulation of thin film mechanical sensitivity for MEMS applications Zhang, Xin Gang Lin Rongming School of Mechanical and Aerospace Engineering DRNTU::Engineering::Mechanical engineering In this report, the use of corrugated diaphragm for microphone sensing is discussed. The corrugated diaphragm is a type of thin film MEMS device that is actuated by an external pressure. The diaphragm’s height is studied in this project to determine the optimum mechanical sensitivity, natural frequency and initial stress loading. The use of ANSYS Finite Element Analysis software is to obtain the necessary values for study instead of actual experiment which is costly and time consuming. The content of this report on ANSYS application, such as modeling and simulation, including detailed procedures taken to obtain the necessary results serves to provide a guide for further research to be carried out. Finally, the comparisons were made between six case studies and the chosen design is concluded based on the criterion of microphone sensing. Bachelor of Engineering 2011-01-25T05:49:45Z 2011-01-25T05:49:45Z 2010 2010 Final Year Project (FYP) http://hdl.handle.net/10356/42866 en Nanyang Technological University 81 p. application/pdf
spellingShingle DRNTU::Engineering::Mechanical engineering
Zhang, Xin Gang
FE simulation of thin film mechanical sensitivity for MEMS applications
title FE simulation of thin film mechanical sensitivity for MEMS applications
title_full FE simulation of thin film mechanical sensitivity for MEMS applications
title_fullStr FE simulation of thin film mechanical sensitivity for MEMS applications
title_full_unstemmed FE simulation of thin film mechanical sensitivity for MEMS applications
title_short FE simulation of thin film mechanical sensitivity for MEMS applications
title_sort fe simulation of thin film mechanical sensitivity for mems applications
topic DRNTU::Engineering::Mechanical engineering
url http://hdl.handle.net/10356/42866
work_keys_str_mv AT zhangxingang fesimulationofthinfilmmechanicalsensitivityformemsapplications