Studying of kissing bond using scanning acoustic microscope
Kissing bond is an adhesive bonding defect and is thought to arise from either contamination of the surfaces during manufacture or various forms of environmental attack. It is especially dangerous because it is often the likely cause for premature failure in the adhesive joints. Hence, there is a ne...
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| Format: | Final Year Project (FYP) |
| Language: | English |
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2011
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| Online Access: | http://hdl.handle.net/10356/44592 |
| _version_ | 1811682421545893888 |
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| author | Tan, Yong Kang. |
| author2 | Wong, Brian Stephen |
| author_facet | Wong, Brian Stephen Tan, Yong Kang. |
| author_sort | Tan, Yong Kang. |
| collection | NTU |
| description | Kissing bond is an adhesive bonding defect and is thought to arise from either contamination of the surfaces during manufacture or various forms of environmental attack. It is especially dangerous because it is often the likely cause for premature failure in the adhesive joints. Hence, there is a need to detect this defect in the earlier stage of manufacturing.
This report presents the study of kissing bond and its detectability using a non-destructive technique, namely, the Scanning Acoustic Microscopy (S.A.M). The background of this technique and the procedures that are undertaken for the project have been allocated in a chapter to aid the readers in the understanding of the project.
Using S.A.M, the images of the defect and the velocity of the surface acoustic waves are obtained through the usage of the point-focus acoustic microscopy. Using the V(z) technique, the V(z) curve and the Rayleigh velocities were measured and used to characterize the properties of the kissing bond that is created under different conditions. The results show that S.A.M is able to detect the defect accurately and characterize its bond strength quantitatively.
In addition, the effects of the torque applied on the dry kissing bonds were also studied in this project. Lastly, various factors affecting the accuracy of the measurements were also discussed in this project. In the end of this report, some recommendations were made for the future project to improve the accuracy of the experimental results. |
| first_indexed | 2024-10-01T03:56:34Z |
| format | Final Year Project (FYP) |
| id | ntu-10356/44592 |
| institution | Nanyang Technological University |
| language | English |
| last_indexed | 2024-10-01T03:56:34Z |
| publishDate | 2011 |
| record_format | dspace |
| spelling | ntu-10356/445922023-03-04T18:44:15Z Studying of kissing bond using scanning acoustic microscope Tan, Yong Kang. Wong, Brian Stephen School of Mechanical and Aerospace Engineering DRNTU::Engineering::Mechanical engineering Kissing bond is an adhesive bonding defect and is thought to arise from either contamination of the surfaces during manufacture or various forms of environmental attack. It is especially dangerous because it is often the likely cause for premature failure in the adhesive joints. Hence, there is a need to detect this defect in the earlier stage of manufacturing. This report presents the study of kissing bond and its detectability using a non-destructive technique, namely, the Scanning Acoustic Microscopy (S.A.M). The background of this technique and the procedures that are undertaken for the project have been allocated in a chapter to aid the readers in the understanding of the project. Using S.A.M, the images of the defect and the velocity of the surface acoustic waves are obtained through the usage of the point-focus acoustic microscopy. Using the V(z) technique, the V(z) curve and the Rayleigh velocities were measured and used to characterize the properties of the kissing bond that is created under different conditions. The results show that S.A.M is able to detect the defect accurately and characterize its bond strength quantitatively. In addition, the effects of the torque applied on the dry kissing bonds were also studied in this project. Lastly, various factors affecting the accuracy of the measurements were also discussed in this project. In the end of this report, some recommendations were made for the future project to improve the accuracy of the experimental results. Bachelor of Engineering (Mechanical Engineering) 2011-06-02T07:26:01Z 2011-06-02T07:26:01Z 2011 2011 Final Year Project (FYP) http://hdl.handle.net/10356/44592 en Nanyang Technological University 121 p. application/pdf |
| spellingShingle | DRNTU::Engineering::Mechanical engineering Tan, Yong Kang. Studying of kissing bond using scanning acoustic microscope |
| title | Studying of kissing bond using scanning acoustic microscope |
| title_full | Studying of kissing bond using scanning acoustic microscope |
| title_fullStr | Studying of kissing bond using scanning acoustic microscope |
| title_full_unstemmed | Studying of kissing bond using scanning acoustic microscope |
| title_short | Studying of kissing bond using scanning acoustic microscope |
| title_sort | studying of kissing bond using scanning acoustic microscope |
| topic | DRNTU::Engineering::Mechanical engineering |
| url | http://hdl.handle.net/10356/44592 |
| work_keys_str_mv | AT tanyongkang studyingofkissingbondusingscanningacousticmicroscope |