Strength and toughness of bonded joints in thermoplastic polymer microfluidic devices
In the field of hot embossing of polymers for microfluidic, there is a lack of study into the relationships of bonding strength and bonding toughness with regard to the different bonding parameters. This project aims to explore the relationship of bonding strength and toughness under different pa...
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| Other Authors: | |
| Format: | Final Year Project (FYP) |
| Language: | English |
| Published: |
2011
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| Online Access: | http://hdl.handle.net/10356/45245 |
| _version_ | 1826124240402776064 |
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| author | Toh, Ming Loon. |
| author2 | Yue Chee Yoon |
| author_facet | Yue Chee Yoon Toh, Ming Loon. |
| author_sort | Toh, Ming Loon. |
| collection | NTU |
| description | In the field of hot embossing of polymers for microfluidic, there is a lack of study into the relationships of bonding strength and bonding toughness with regard to the different bonding parameters.
This project aims to explore the relationship of bonding strength and toughness under different parameters, which are identified as bonding temperature, time and loading. The material that is used for the entire course of experiment is TOPAS® COC grade 8007. Although this thermoplastic copolymer is a relatively new polymer material, it is a low-cost alternative that has been gaining popularity due to its excellent physical and chemical properties. Injection molding process will be carried to produce the polymer substrates due to its fast production rate and high output accuracy. |
| first_indexed | 2024-10-01T06:17:25Z |
| format | Final Year Project (FYP) |
| id | ntu-10356/45245 |
| institution | Nanyang Technological University |
| language | English |
| last_indexed | 2024-10-01T06:17:25Z |
| publishDate | 2011 |
| record_format | dspace |
| spelling | ntu-10356/452452023-03-04T18:57:00Z Strength and toughness of bonded joints in thermoplastic polymer microfluidic devices Toh, Ming Loon. Yue Chee Yoon School of Mechanical and Aerospace Engineering DRNTU::Engineering DRNTU::Engineering::Materials::Mechanical strength of materials In the field of hot embossing of polymers for microfluidic, there is a lack of study into the relationships of bonding strength and bonding toughness with regard to the different bonding parameters. This project aims to explore the relationship of bonding strength and toughness under different parameters, which are identified as bonding temperature, time and loading. The material that is used for the entire course of experiment is TOPAS® COC grade 8007. Although this thermoplastic copolymer is a relatively new polymer material, it is a low-cost alternative that has been gaining popularity due to its excellent physical and chemical properties. Injection molding process will be carried to produce the polymer substrates due to its fast production rate and high output accuracy. Bachelor of Engineering (Mechanical Engineering) 2011-06-10T04:05:34Z 2011-06-10T04:05:34Z 2011 2011 Final Year Project (FYP) http://hdl.handle.net/10356/45245 en Nanyang Technological University 72 p. application/pdf |
| spellingShingle | DRNTU::Engineering DRNTU::Engineering::Materials::Mechanical strength of materials Toh, Ming Loon. Strength and toughness of bonded joints in thermoplastic polymer microfluidic devices |
| title | Strength and toughness of bonded joints in thermoplastic polymer microfluidic devices |
| title_full | Strength and toughness of bonded joints in thermoplastic polymer microfluidic devices |
| title_fullStr | Strength and toughness of bonded joints in thermoplastic polymer microfluidic devices |
| title_full_unstemmed | Strength and toughness of bonded joints in thermoplastic polymer microfluidic devices |
| title_short | Strength and toughness of bonded joints in thermoplastic polymer microfluidic devices |
| title_sort | strength and toughness of bonded joints in thermoplastic polymer microfluidic devices |
| topic | DRNTU::Engineering DRNTU::Engineering::Materials::Mechanical strength of materials |
| url | http://hdl.handle.net/10356/45245 |
| work_keys_str_mv | AT tohmingloon strengthandtoughnessofbondedjointsinthermoplasticpolymermicrofluidicdevices |