Strength and toughness of bonded joints in thermoplastic polymer microfluidic devices
In the field of hot embossing of polymers for microfluidic, there is a lack of study into the relationships of bonding strength and bonding toughness with regard to the different bonding parameters. This project aims to explore the relationship of bonding strength and toughness under different pa...
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| Format: | Final Year Project (FYP) |
| Language: | English |
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2011
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| Online Access: | http://hdl.handle.net/10356/45245 |