NDT of adhesively bonded structure based on the impedance method
171 p.
| Main Authors: | , , , , , |
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| Other Authors: | |
| Format: | Research Report |
| Published: |
2011
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| Subjects: | |
| Online Access: | http://hdl.handle.net/10356/46635 |
| _version_ | 1811688116673576960 |
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| author | Lim, Mong King Liew, Kim Meow Low, Seow Chay Wong, Brian Stephen Jiang Li Tui, Chen Guan |
| author2 | School of Mechanical and Production Engineering |
| author_facet | School of Mechanical and Production Engineering Lim, Mong King Liew, Kim Meow Low, Seow Chay Wong, Brian Stephen Jiang Li Tui, Chen Guan |
| author_sort | Lim, Mong King |
| collection | NTU |
| description | 171 p. |
| first_indexed | 2024-10-01T05:27:06Z |
| format | Research Report |
| id | ntu-10356/46635 |
| institution | Nanyang Technological University |
| last_indexed | 2024-10-01T05:27:06Z |
| publishDate | 2011 |
| record_format | dspace |
| spelling | ntu-10356/466352023-03-04T18:07:50Z NDT of adhesively bonded structure based on the impedance method Lim, Mong King Liew, Kim Meow Low, Seow Chay Wong, Brian Stephen Jiang Li Tui, Chen Guan School of Mechanical and Production Engineering DRNTU::Engineering::Aeronautical engineering 171 p. The use of the mechanical impedance method for non-destructive testing and analysis of honeycomb structures is described in this study. Mechanical impedance instruments, MIA 3000, Versiscan and VP 200, were used to study the detachment of honeycomb structures on specimens which were made of two layers of thin aluminium skins with Nomex honeycomb cores. RP 38/91 2011-12-21T03:12:49Z 2011-12-21T03:12:49Z 1994 1994 Research Report http://hdl.handle.net/10356/46635 Nanyang Technological University application/pdf |
| spellingShingle | DRNTU::Engineering::Aeronautical engineering Lim, Mong King Liew, Kim Meow Low, Seow Chay Wong, Brian Stephen Jiang Li Tui, Chen Guan NDT of adhesively bonded structure based on the impedance method |
| title | NDT of adhesively bonded structure based on the impedance method |
| title_full | NDT of adhesively bonded structure based on the impedance method |
| title_fullStr | NDT of adhesively bonded structure based on the impedance method |
| title_full_unstemmed | NDT of adhesively bonded structure based on the impedance method |
| title_short | NDT of adhesively bonded structure based on the impedance method |
| title_sort | ndt of adhesively bonded structure based on the impedance method |
| topic | DRNTU::Engineering::Aeronautical engineering |
| url | http://hdl.handle.net/10356/46635 |
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