NDT of adhesively bonded structure based on the impedance method

NDT of adhesively bonded structure based on the impedance method

171 p.

Bibliographic Details
Main Authors:	Lim, Mong King, Liew, Kim Meow, Low, Seow Chay, Wong, Brian Stephen, Jiang Li, Tui, Chen Guan
Other Authors:	School of Mechanical and Production Engineering
Format:	Research Report
Published:	2011
Subjects:	DRNTU::Engineering::Aeronautical engineering
Online Access:	http://hdl.handle.net/10356/46635

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