Electrical modeling of through-silicon-via for 3D integrated circuits

Electrical modeling of through-silicon-via for 3D integrated circuits

117 p.

Bibliographic Details
Main Author:	Santhosh Onkaraiah.
Other Authors:	Tan Chuan Seng
Format:	Thesis
Published:	2011
Subjects:	DRNTU::Engineering::Electrical and electronic engineering::Integrated circuits
Online Access:	http://hdl.handle.net/10356/46790

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