Modelling of a mems microphone using wafer bonding technology

Modelling of a mems microphone using wafer bonding technology

111 p.

Bibliographic Details
Main Author:	Tan, Chee Wee.
Other Authors:	Miao Jianmin
Format:	Thesis
Published:	2011
Subjects:	DRNTU::Engineering
Online Access:	http://hdl.handle.net/10356/47130

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