Micro-doping in ultrafine-grained gold bonding wires
227 p.
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| Other Authors: | |
| Format: | Thesis |
| Published: |
2011
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| Online Access: | https://hdl.handle.net/10356/47295 |
| _version_ | 1826110684216164352 |
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| author | Chew, Effie Yeong Huey |
| author2 | Wong Chee Cheong |
| author_facet | Wong Chee Cheong Chew, Effie Yeong Huey |
| author_sort | Chew, Effie Yeong Huey |
| collection | NTU |
| description | 227 p. |
| first_indexed | 2024-10-01T02:38:11Z |
| format | Thesis |
| id | ntu-10356/47295 |
| institution | Nanyang Technological University |
| last_indexed | 2024-10-01T02:38:11Z |
| publishDate | 2011 |
| record_format | dspace |
| spelling | ntu-10356/472952023-03-04T16:48:02Z Micro-doping in ultrafine-grained gold bonding wires Chew, Effie Yeong Huey Wong Chee Cheong School of Materials Science & Engineering DRNTU::Engineering::Materials 227 p. Wire bonding remains the dominant form of interconnection technology, and is expected to be used in 85% of total IC units worldwide by 2010. As device miniaturization continues, the diameters of wires get finer, requiring higher mechanical strength from the thin wires for handling. However, strong wires with low ductility pose an insurmountable hurdle in manufacturing because of formability issues. Therefore, strategies to attain both high strength and ductility (dual improvement) in Au wires need to be developed, a goal shared by researchers in the field of nanocrystalline (NC) and ultrafine-grained (UFG) materials. DOCTOR OF PHILOSOPHY (MSE) 2011-12-27T06:54:43Z 2011-12-27T06:54:43Z 2009 2009 Thesis Chew, E. Y. H. (2009). Micro-doping in ultrafine-grained gold bonding wires. Doctoral thesis, Nanyang Technological University, Singapore. https://hdl.handle.net/10356/47295 10.32657/10356/47295 Nanyang Technological University application/pdf |
| spellingShingle | DRNTU::Engineering::Materials Chew, Effie Yeong Huey Micro-doping in ultrafine-grained gold bonding wires |
| title | Micro-doping in ultrafine-grained gold bonding wires |
| title_full | Micro-doping in ultrafine-grained gold bonding wires |
| title_fullStr | Micro-doping in ultrafine-grained gold bonding wires |
| title_full_unstemmed | Micro-doping in ultrafine-grained gold bonding wires |
| title_short | Micro-doping in ultrafine-grained gold bonding wires |
| title_sort | micro doping in ultrafine grained gold bonding wires |
| topic | DRNTU::Engineering::Materials |
| url | https://hdl.handle.net/10356/47295 |
| work_keys_str_mv | AT cheweffieyeonghuey microdopinginultrafinegrainedgoldbondingwires |