Micro-doping in ultrafine-grained gold bonding wires

Micro-doping in ultrafine-grained gold bonding wires

227 p.

Bibliographic Details
Main Author:	Chew, Effie Yeong Huey
Other Authors:	Wong Chee Cheong
Format:	Thesis
Published:	2011
Subjects:	DRNTU::Engineering::Materials
Online Access:	https://hdl.handle.net/10356/47295

Similar Items

Role of dopants on the properties of gold bonding wire
by: Saraswati.
Published: (2008)

A micromechanism study of thermosonic gold wire bonding on aluminium pad
by: Xu, Hui, et al.
Published: (2012)

Development of high strength gold bonding wires for fine pitch wire bonding process
by: Dong, Albert Renjun
Published: (2008)

A Window clamp mechanism design for thermosonic gold wire bonding
by: Kwan, Ka Shing.
Published: (2009)

Ultra-fine pitch palladium-coated copper wire bonding : effect of bonding parameters
by: Lim, Adeline B. Y., et al.
Published: (2014)

Ultrafine gold nanowire networks as plasmonic antennae in organic photovoltaics
by: Oo, Than Z., et al.
Published: (2013)

Critical temperatures in thermocompression gold stud bonding
by: Zhang, G. G., et al.
Published: (2012)

Decapsulation of IC packages with silver wire bonds for failure analysis
by: Matthews, Lynzen
Published: (2023)

Powder-Route Synthesis and Mechanical Testing of Ultrafine Grain Tungsten Alloys
by: Cordero, Zachary C., et al.
Published: (2016)

Effect of cold work on the mechanical response of drawn ultra-fine gold wire
by: Sridhar, Idapalapati, et al.
Published: (2011)

Effect of chain length on low temperature gold-gold bonding by self assembled monolayers
by: Ang, X. F., et al.
Published: (2012)

The structural and bonding evolution in cysteine–gold cluster complexes
by: Zhao, Yaxue, et al.
Published: (2013)

Study of process responses, intermetallic formation and reliability of palladium-coated copper wire bonds
by: Lim, Adeline Bee Yen
Published: (2016)

Reliability of copper wire bonding
by: Ang, Joash Wei Qiang
Published: (2012)

Characterisation of thermosonic applications in wire bonding
by: Moey, Chin Hui.
Published: (2008)

Preparation and characterization of ultrafine nanoparticles of Cu doped lithium tetraborate
by: Khalilzadeh, Nasrin, et al.
Published: (2015)

Image analysis on wire bonding
by: Mohd. Noor, Norliza
Published: (2005)

Wire or no wire : depends on the catalyst layer thickness
by: Zhao, Dongliang, et al.
Published: (2013)

Formulation and characterization of micro/nano Cu paste for electronics bonding
by: Ang, Kok Yong
Published: (2018)

Study of mechanism of ultrasonic wire bonding process
by: Zhang, Dong
Published: (2008)

Synthesis of barium ferrite ultrafine powders by a sol–gel combustion method using glycine gels
by: Jiao, D.L., et al.
Published: (2014)

Ultrafine pitch (6-µm) evolution of Cu-Cu bonded interconnects in 3D wafer-on-wafer stacking
by: Peng, L., et al.
Published: (2013)

Low temperature thermocompression bonding of copper-copper bumps using gold alloy nanoparticles
by: Tan, Shi Liang.
Published: (2012)

Investigation on the role of Sb doping on grain growth and properties of solution-processed CuIn(S,Se)2
by: Ho, John Chun Wan
Published: (2015)

A vision problem in wire bonding
by: Mohd. Noor, Norliza, et al.
Published: (2000)

A novel combined severe plastic deformation method for producing thin-walled ultrafine grained cylindrical tubes
by: Abdolvand, H., et al.
Published: (2015)

Surface manipulation using gold micro pattern to modulate stem cell behaviour
by: Arliando Setiadi
Published: (2015)

An on-line statistical process control application for wire bond
by: Liu, Hann Wen.
Published: (2008)

Dynamic characteristics of the wire bonding process in electronic packaging
by: Hu, Changmin.
Published: (2008)

Effects of doping concentration on bond length and bond energy studied by Raman shift
by: Yang, Xuexian, et al.
Published: (2023)

Effect of BOE etching time on wire bonding quality
by: Tan, Cher Ming, et al.
Published: (2009)

Micro-wire joining design setup and testing
by: Natarajan Nishanth
Published: (2015)

Robust lignin-based aerogel filters : high-efficiency capture of ultrafine airborne particulates and the mechanism
by: Zeng, Zhihui, et al.
Published: (2019)

Design and production of dies for micro wire drawing
by: Tan, Guo Dong.
Published: (2010)

Development of wafer bonding technology for micro-electro-mechanical systems application
by: Wang, Lei.
Published: (2008)

Bonding of micro devices
by: Peh, Chow Keong.
Published: (2012)

Time Domain Reflection Method To Detect Copper Wire Micro Crack Weld Defect
by: Robin, Ong Su Kiat
Published: (2016)

Development of insulated cu wire stitch bonding
by: Leong, H.Y., et al.
Published: (2013)

Stitch bond strength study in insulated Cu wire bonding
by: Leong, H.Y., et al.
Published: (2014)

Adhesive bonding of thermoplastic polyurethane with metallic wire
by: Abdullahi, Tijjani, et al.
Published: (2018)