Stress analysis for crack problems due to thermal mismatch
Microelectromechanical Systems (MEMS) fabrication process encounts many engineering challenges in the manufacturing industry. With the rapid advancement of technology, it is inevitable that there is a greater demand for MEMS products. In MEMS fabrications procedures, the key components are silicon i...
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| Format: | Final Year Project (FYP) |
| Language: | English |
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2012
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| Online Access: | http://hdl.handle.net/10356/49353 |