Defect engineering coupled with pulsed laser annealing for p+/n junction formation and pMOSFETs device enhancement
The aggressive miniaturization of the MOS technology as anticipated by the Moore’s law, demands for the constant exploration of novel methods to obtain highly activated and abrupt shallow junctions. As the devices shrink down to nanoscale dimensions, it is becoming increasingly challenging to keep u...
Autor Principal: | Tan, Dexter Xueming. |
---|---|
Outros autores: | Pey Kin Leong |
Formato: | Thesis |
Idioma: | English |
Publicado: |
2012
|
Subjects: | |
Acceso en liña: | http://hdl.handle.net/10356/49978 |
Títulos similares
-
Pulsed laser annealing for the formation of ultra-shallow junctions for nano-scale metal-oxide-semiconductor technologies
por: Ong, Kuang Kian
Publicado: (2010) -
Impact of spike anneal on ultra shallow junction formation
por: Lai, Chung Woh
Publicado: (2008) -
Study of digital breakdown in pMOSFETs with ultrathin gate dielectric and its significance to reliability assessment
por: Ashwin Srinivas.
Publicado: (2010) -
The Improvement of Reliability of High-k/Metal Gate pMOSFET Device with Various PMA Conditions
por: Yi-Lin Yang, et al.
Publicado: (2012-01-01) -
Pulsed laser annealed silicides formation for advanced MOS applications
por: Yudi, Setiawan.
Publicado: (2009)