Bonding of micro devices
In recent years, bonding device has evolved from small application such as toys to big application such as cars. Materials to be used has been changed from glass in the past to current thermoplastic such as Poly(methyl Methacrylate) PMMA for its durability and other characteristic.
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| Other Authors: | |
| Format: | Final Year Project (FYP) |
| Language: | English |
| Published: |
2012
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| Online Access: | http://hdl.handle.net/10356/50340 |
| _version_ | 1811697254639075328 |
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| author | Peh, Chow Keong. |
| author2 | Tor Shu Beng |
| author_facet | Tor Shu Beng Peh, Chow Keong. |
| author_sort | Peh, Chow Keong. |
| collection | NTU |
| description | In recent years, bonding device has evolved from small application such as toys to big application such as cars. Materials to be used has been changed from glass in the past to current thermoplastic such as Poly(methyl Methacrylate) PMMA for its durability and other characteristic. |
| first_indexed | 2024-10-01T07:52:20Z |
| format | Final Year Project (FYP) |
| id | ntu-10356/50340 |
| institution | Nanyang Technological University |
| language | English |
| last_indexed | 2024-10-01T07:52:20Z |
| publishDate | 2012 |
| record_format | dspace |
| spelling | ntu-10356/503402023-03-04T18:28:44Z Bonding of micro devices Peh, Chow Keong. Tor Shu Beng School of Mechanical and Aerospace Engineering DRNTU::Engineering::Mechanical engineering In recent years, bonding device has evolved from small application such as toys to big application such as cars. Materials to be used has been changed from glass in the past to current thermoplastic such as Poly(methyl Methacrylate) PMMA for its durability and other characteristic. Bachelor of Engineering (Mechanical Engineering) 2012-06-01T02:37:41Z 2012-06-01T02:37:41Z 2012 2012 Final Year Project (FYP) http://hdl.handle.net/10356/50340 en Nanyang Technological University 122 p. application/pdf |
| spellingShingle | DRNTU::Engineering::Mechanical engineering Peh, Chow Keong. Bonding of micro devices |
| title | Bonding of micro devices |
| title_full | Bonding of micro devices |
| title_fullStr | Bonding of micro devices |
| title_full_unstemmed | Bonding of micro devices |
| title_short | Bonding of micro devices |
| title_sort | bonding of micro devices |
| topic | DRNTU::Engineering::Mechanical engineering |
| url | http://hdl.handle.net/10356/50340 |
| work_keys_str_mv | AT pehchowkeong bondingofmicrodevices |