Application of chemical mechanical polishing for sub-micron semiconductor device fabrication
This project investigated the process parameters, polishing consumables and pattern density dependencies in shallow trench isolation process performance.
| Main Author: | |
|---|---|
| Other Authors: | |
| Format: | Thesis |
| Language: | English |
| Published: |
2008
|
| Subjects: | |
| Online Access: | http://hdl.handle.net/10356/5050 |
| _version_ | 1811694257800478720 |
|---|---|
| author | Goh, Hua Kooi. |
| author2 | Higelin, Gerald |
| author_facet | Higelin, Gerald Goh, Hua Kooi. |
| author_sort | Goh, Hua Kooi. |
| collection | NTU |
| description | This project investigated the process parameters, polishing consumables and pattern density dependencies in shallow trench isolation process performance. |
| first_indexed | 2024-10-01T07:04:42Z |
| format | Thesis |
| id | ntu-10356/5050 |
| institution | Nanyang Technological University |
| language | English |
| last_indexed | 2024-10-01T07:04:42Z |
| publishDate | 2008 |
| record_format | dspace |
| spelling | ntu-10356/50502020-06-01T11:56:47Z Application of chemical mechanical polishing for sub-micron semiconductor device fabrication Goh, Hua Kooi. Higelin, Gerald School of Materials Science & Engineering DRNTU::Engineering::Materials::Microelectronics and semiconductor materials This project investigated the process parameters, polishing consumables and pattern density dependencies in shallow trench isolation process performance. Master of Applied Science 2008-09-17T10:18:27Z 2008-09-17T10:18:27Z 2001 2001 Thesis http://hdl.handle.net/10356/5050 en Nanyang Technological University 149 p. application/pdf |
| spellingShingle | DRNTU::Engineering::Materials::Microelectronics and semiconductor materials Goh, Hua Kooi. Application of chemical mechanical polishing for sub-micron semiconductor device fabrication |
| title | Application of chemical mechanical polishing for sub-micron semiconductor device fabrication |
| title_full | Application of chemical mechanical polishing for sub-micron semiconductor device fabrication |
| title_fullStr | Application of chemical mechanical polishing for sub-micron semiconductor device fabrication |
| title_full_unstemmed | Application of chemical mechanical polishing for sub-micron semiconductor device fabrication |
| title_short | Application of chemical mechanical polishing for sub-micron semiconductor device fabrication |
| title_sort | application of chemical mechanical polishing for sub micron semiconductor device fabrication |
| topic | DRNTU::Engineering::Materials::Microelectronics and semiconductor materials |
| url | http://hdl.handle.net/10356/5050 |
| work_keys_str_mv | AT gohhuakooi applicationofchemicalmechanicalpolishingforsubmicronsemiconductordevicefabrication |