Role of dopants on the properties of gold bonding wire
Gold bonding wire is a widely used electrically conducting interconnection in microelectronics industry, due to its good combination of inertness and low resistivity. The increasing miniaturization of electronics required the reduction in the pitch of the input/output inter-connections, and conseque...
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| Format: | Thesis |
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2008
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| Online Access: | http://hdl.handle.net/10356/5103 |
| _version_ | 1826114849852096512 |
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| author | Saraswati. |
| author2 | Sritharan, Thirumany |
| author_facet | Sritharan, Thirumany Saraswati. |
| author_sort | Saraswati. |
| collection | NTU |
| description | Gold bonding wire is a widely used electrically conducting interconnection in microelectronics industry, due to its good combination of inertness and low resistivity. The increasing miniaturization of electronics required the reduction in the pitch of the input/output inter-connections, and consequently made it necessary to reduce the wire diameter, while maintaining, or even increasing its performance. |
| first_indexed | 2024-10-01T03:45:54Z |
| format | Thesis |
| id | ntu-10356/5103 |
| institution | Nanyang Technological University |
| last_indexed | 2024-10-01T03:45:54Z |
| publishDate | 2008 |
| record_format | dspace |
| spelling | ntu-10356/51032023-03-04T16:34:04Z Role of dopants on the properties of gold bonding wire Saraswati. Sritharan, Thirumany School of Materials Science & Engineering DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects Gold bonding wire is a widely used electrically conducting interconnection in microelectronics industry, due to its good combination of inertness and low resistivity. The increasing miniaturization of electronics required the reduction in the pitch of the input/output inter-connections, and consequently made it necessary to reduce the wire diameter, while maintaining, or even increasing its performance. Doctor of Philosophy (SME) 2008-09-17T10:20:03Z 2008-09-17T10:20:03Z 2004 2004 Thesis http://hdl.handle.net/10356/5103 Nanyang Technological University 97 p. application/pdf |
| spellingShingle | DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects Saraswati. Role of dopants on the properties of gold bonding wire |
| title | Role of dopants on the properties of gold bonding wire |
| title_full | Role of dopants on the properties of gold bonding wire |
| title_fullStr | Role of dopants on the properties of gold bonding wire |
| title_full_unstemmed | Role of dopants on the properties of gold bonding wire |
| title_short | Role of dopants on the properties of gold bonding wire |
| title_sort | role of dopants on the properties of gold bonding wire |
| topic | DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects |
| url | http://hdl.handle.net/10356/5103 |
| work_keys_str_mv | AT saraswati roleofdopantsonthepropertiesofgoldbondingwire |