Tantalum based amorphous thin films as copper diffusion barrier
This dissertation presents a study of Ta-based Cu diffusion barrier for advanced semiconductor technology. With the fast development of semiconductor industry, a novel barrier is required in order to address two challenges in the back-end-of-line technology: enhancing the interconnect reliability of...
| Main Author: | |
|---|---|
| Other Authors: | |
| Format: | Thesis |
| Language: | English |
| Published: |
2013
|
| Subjects: | |
| Online Access: | https://hdl.handle.net/10356/51780 |