Evaluation of tungsten metallization on alumina substrates for extreme environment package level interconnection
The demand for high performance electronics has increased significantly over the past few decades. Metallization is widely used as to connect devices electrically to each other and to the outside environment. This study aims to study and analyze the effects of tungsten metallization on alumina su...
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| Other Authors: | |
| Format: | Final Year Project (FYP) |
| Language: | English |
| Published: |
2013
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| Online Access: | http://hdl.handle.net/10356/52006 |
| _version_ | 1826124221108977664 |
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| author | Huang, Clare Guanqi. |
| author2 | Gan Chee Lip |
| author_facet | Gan Chee Lip Huang, Clare Guanqi. |
| author_sort | Huang, Clare Guanqi. |
| collection | NTU |
| description | The demand for high performance electronics has increased significantly over the past few decades. Metallization is widely used as to connect devices electrically to each other and to the outside environment.
This study aims to study and analyze the effects of tungsten metallization on alumina substrates for extreme environment package level interconnection. The results of these effects will be compared to aluminium and silver metallization on alumina substrates. Aluminium has been commonly used as metallization on integrated circuits for interconnects for decades, as such making the comparison of tungsten to alumina justifiable. On the other hand, silver is known to have one of the poorest adhesions on alumina substrates, hence also selected to be used as our control as the other extreme in this experiment.
In this research study, deposition of metal on alumina substrate will be done followed by aging in high temperature and high pressure environment. After aging, characterization tests such as the pull test, chevron test and electrical test will be done in order to study the effects that the extreme environment has on the metallization on alumina substrates to decide if tungsten will be a suitable material for metallization as part of the package level interconnection. |
| first_indexed | 2024-10-01T06:17:07Z |
| format | Final Year Project (FYP) |
| id | ntu-10356/52006 |
| institution | Nanyang Technological University |
| language | English |
| last_indexed | 2024-10-01T06:17:07Z |
| publishDate | 2013 |
| record_format | dspace |
| spelling | ntu-10356/520062023-03-04T15:40:13Z Evaluation of tungsten metallization on alumina substrates for extreme environment package level interconnection Huang, Clare Guanqi. Gan Chee Lip School of Materials Science and Engineering DRNTU::Engineering The demand for high performance electronics has increased significantly over the past few decades. Metallization is widely used as to connect devices electrically to each other and to the outside environment. This study aims to study and analyze the effects of tungsten metallization on alumina substrates for extreme environment package level interconnection. The results of these effects will be compared to aluminium and silver metallization on alumina substrates. Aluminium has been commonly used as metallization on integrated circuits for interconnects for decades, as such making the comparison of tungsten to alumina justifiable. On the other hand, silver is known to have one of the poorest adhesions on alumina substrates, hence also selected to be used as our control as the other extreme in this experiment. In this research study, deposition of metal on alumina substrate will be done followed by aging in high temperature and high pressure environment. After aging, characterization tests such as the pull test, chevron test and electrical test will be done in order to study the effects that the extreme environment has on the metallization on alumina substrates to decide if tungsten will be a suitable material for metallization as part of the package level interconnection. Bachelor of Engineering (Materials Engineering) 2013-04-19T04:00:52Z 2013-04-19T04:00:52Z 2013 2013 Final Year Project (FYP) http://hdl.handle.net/10356/52006 en Nanyang Technological University 53 p. application/pdf |
| spellingShingle | DRNTU::Engineering Huang, Clare Guanqi. Evaluation of tungsten metallization on alumina substrates for extreme environment package level interconnection |
| title | Evaluation of tungsten metallization on alumina substrates for extreme environment package level interconnection |
| title_full | Evaluation of tungsten metallization on alumina substrates for extreme environment package level interconnection |
| title_fullStr | Evaluation of tungsten metallization on alumina substrates for extreme environment package level interconnection |
| title_full_unstemmed | Evaluation of tungsten metallization on alumina substrates for extreme environment package level interconnection |
| title_short | Evaluation of tungsten metallization on alumina substrates for extreme environment package level interconnection |
| title_sort | evaluation of tungsten metallization on alumina substrates for extreme environment package level interconnection |
| topic | DRNTU::Engineering |
| url | http://hdl.handle.net/10356/52006 |
| work_keys_str_mv | AT huangclareguanqi evaluationoftungstenmetallizationonaluminasubstratesforextremeenvironmentpackagelevelinterconnection |