Indentation creep study on metal composite solder with different particle size
To enhance the creep resistance of eutectic Sn-58Bi solder alloy, low concentration of copper fillers with two sizes, i.e. 3μm and 45μm, have been added into alloys respectively. Their elastic modulus, hardness and creep stress exponent were characterized by using nanoindentation constant strain rat...
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| Format: | Final Year Project (FYP) |
| Language: | English |
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2013
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| Online Access: | http://hdl.handle.net/10356/52094 |