Characterization of aluminium pad under different process conditions
The objective of this study is to improve the aluminum film uniformity by optimizing the process condition. The aluminum film was deposited by a sputtering process on 200mm wafers in AMAT Endura® PVD chambers.
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| Other Authors: | |
| Format: | Thesis |
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2008
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| Online Access: | http://hdl.handle.net/10356/5340 |
| _version_ | 1826126366867718144 |
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| author | Wang, Jian Hua. |
| author2 | Zhong, Zhaowei |
| author_facet | Zhong, Zhaowei Wang, Jian Hua. |
| author_sort | Wang, Jian Hua. |
| collection | NTU |
| description | The objective of this study is to improve the aluminum film uniformity by optimizing the process condition. The aluminum film was deposited by a sputtering process on 200mm wafers in AMAT Endura® PVD chambers. |
| first_indexed | 2024-10-01T06:51:30Z |
| format | Thesis |
| id | ntu-10356/5340 |
| institution | Nanyang Technological University |
| last_indexed | 2024-10-01T06:51:30Z |
| publishDate | 2008 |
| record_format | dspace |
| spelling | ntu-10356/53402023-03-11T17:17:59Z Characterization of aluminium pad under different process conditions Wang, Jian Hua. Zhong, Zhaowei School of Mechanical and Production Engineering DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Thin films The objective of this study is to improve the aluminum film uniformity by optimizing the process condition. The aluminum film was deposited by a sputtering process on 200mm wafers in AMAT Endura® PVD chambers. Master of Science (Precision Engineering) 2008-09-17T10:48:09Z 2008-09-17T10:48:09Z 2004 2004 Thesis http://hdl.handle.net/10356/5340 Nanyang Technological University application/pdf |
| spellingShingle | DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Thin films Wang, Jian Hua. Characterization of aluminium pad under different process conditions |
| title | Characterization of aluminium pad under different process conditions |
| title_full | Characterization of aluminium pad under different process conditions |
| title_fullStr | Characterization of aluminium pad under different process conditions |
| title_full_unstemmed | Characterization of aluminium pad under different process conditions |
| title_short | Characterization of aluminium pad under different process conditions |
| title_sort | characterization of aluminium pad under different process conditions |
| topic | DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Thin films |
| url | http://hdl.handle.net/10356/5340 |
| work_keys_str_mv | AT wangjianhua characterizationofaluminiumpadunderdifferentprocessconditions |