Process methodology for semiconductor parametric extraction and analysis

The purpose of this report is to provide a summary of the Final Year Project (FYP) that is done together with a researcher. In this report, the characterization of the laser etch facet during fabrication, characterization of the laser performance and creation of the light intensity measurement LabVI...

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Bibliographic Details
Main Author: Lim, Shihui.
Other Authors: Yoon Soon Fatt
Format: Final Year Project (FYP)
Language:English
Published: 2013
Subjects:
Online Access:http://hdl.handle.net/10356/53402
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author Lim, Shihui.
author2 Yoon Soon Fatt
author_facet Yoon Soon Fatt
Lim, Shihui.
author_sort Lim, Shihui.
collection NTU
description The purpose of this report is to provide a summary of the Final Year Project (FYP) that is done together with a researcher. In this report, the characterization of the laser etch facet during fabrication, characterization of the laser performance and creation of the light intensity measurement LabVIEW program would be explained. Learning of new programming language such as LabVIEW, setting up of laser measurement and experiencing cleanroom fabrication environment processes such as baking, dry and wet etching and etc. was part and parcel of my FYP. The projects include optimizing the etch sidewall with the characterization, researching for new etching recipe, creating new measuring program application for the ease of all users and interpreting of results from the measurement characterization. Researching new etch recipes such as what are the gases should be used and other parameters to consider. For the measurement, based on the research done, different parameters can be extracted out from the results and using these parameters to determine whether if the laser device is function at its expected performance. When problems such as programming or research issue arise, with the researcher’s guidance, the problems can quickly be resolved.
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spelling ntu-10356/534022023-07-07T16:06:08Z Process methodology for semiconductor parametric extraction and analysis Lim, Shihui. Yoon Soon Fatt School of Electrical and Electronic Engineering Yoon Soon Fatt DRNTU::Engineering::Electrical and electronic engineering::Microelectronics The purpose of this report is to provide a summary of the Final Year Project (FYP) that is done together with a researcher. In this report, the characterization of the laser etch facet during fabrication, characterization of the laser performance and creation of the light intensity measurement LabVIEW program would be explained. Learning of new programming language such as LabVIEW, setting up of laser measurement and experiencing cleanroom fabrication environment processes such as baking, dry and wet etching and etc. was part and parcel of my FYP. The projects include optimizing the etch sidewall with the characterization, researching for new etching recipe, creating new measuring program application for the ease of all users and interpreting of results from the measurement characterization. Researching new etch recipes such as what are the gases should be used and other parameters to consider. For the measurement, based on the research done, different parameters can be extracted out from the results and using these parameters to determine whether if the laser device is function at its expected performance. When problems such as programming or research issue arise, with the researcher’s guidance, the problems can quickly be resolved. Bachelor of Engineering 2013-06-03T03:59:59Z 2013-06-03T03:59:59Z 2013 2013 Final Year Project (FYP) http://hdl.handle.net/10356/53402 en Nanyang Technological University 100 p. application/pdf
spellingShingle DRNTU::Engineering::Electrical and electronic engineering::Microelectronics
Lim, Shihui.
Process methodology for semiconductor parametric extraction and analysis
title Process methodology for semiconductor parametric extraction and analysis
title_full Process methodology for semiconductor parametric extraction and analysis
title_fullStr Process methodology for semiconductor parametric extraction and analysis
title_full_unstemmed Process methodology for semiconductor parametric extraction and analysis
title_short Process methodology for semiconductor parametric extraction and analysis
title_sort process methodology for semiconductor parametric extraction and analysis
topic DRNTU::Engineering::Electrical and electronic engineering::Microelectronics
url http://hdl.handle.net/10356/53402
work_keys_str_mv AT limshihui processmethodologyforsemiconductorparametricextractionandanalysis