Wafer-level fine pitch Cu-Cu bonding for 3-D stacking of integrated circuits
The increasing demand for system performance enhancement and more functionality has led to the exploration of 3-D IC technology, which possesses attractive benefits in form factor, density, performance, heterogeneous integration, and lower cost. One of the key challenges to realize 3-D integration i...
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| Format: | Thesis |
| Language: | English |
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2013
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| Online Access: | https://hdl.handle.net/10356/53452 |