Mechanics of materials characterization of lead-free solders
Lead-free solders will replace tin-lead solders in electronic products due to European Union laws to restrict the use of toxic materials like lead (Pb) in electronic equipment by July 1st, 2006. Legislation to ban the use of lead (Pb) is forcing the electronic industry to use lead-free solders. Sold...
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| Format: | Thesis |
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2008
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| Online Access: | https://hdl.handle.net/10356/5423 |
| _version_ | 1811677084534177792 |
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| author | Xiong, Bingshou |
| author2 | Pang Hock Lye, John |
| author_facet | Pang Hock Lye, John Xiong, Bingshou |
| author_sort | Xiong, Bingshou |
| collection | NTU |
| description | Lead-free solders will replace tin-lead solders in electronic products due to European Union laws to restrict the use of toxic materials like lead (Pb) in electronic equipment by July 1st, 2006. Legislation to ban the use of lead (Pb) is forcing the electronic industry to use lead-free solders. Solder interconnections serve as electrical connections and also as the mechanical support to hold the IC component in position on the printed circuit board (PCB). It is important to characterize the mechanical properties of lead-free solders. NEMI (National Electronic Manufacturing Initiative) recommends Sn-3.9Ag-0.6Cu(±0.2%) for reflow soldering process and Sn-0.7Cu solder alloy for wave soldering. The scope of this study includes the two NEMI recommended Pb-free solder alloys, namely Sn-3.8Ag-0.7Cu and Sn-0.7Cu. A mechanics of materials characterization of the elastic-plastic-creep properties and low cycle fatigue behavior is reported. A new visco-plastic constitutive model and fatigue model is presented and used to model the thermal fatigue behavior of a Micro-BGA assembly. |
| first_indexed | 2024-10-01T02:31:45Z |
| format | Thesis |
| id | ntu-10356/5423 |
| institution | Nanyang Technological University |
| last_indexed | 2024-10-01T02:31:45Z |
| publishDate | 2008 |
| record_format | dspace |
| spelling | ntu-10356/54232023-03-11T17:43:52Z Mechanics of materials characterization of lead-free solders Xiong, Bingshou Pang Hock Lye, John School of Mechanical and Aerospace Engineering DRNTU::Engineering::Manufacturing Lead-free solders will replace tin-lead solders in electronic products due to European Union laws to restrict the use of toxic materials like lead (Pb) in electronic equipment by July 1st, 2006. Legislation to ban the use of lead (Pb) is forcing the electronic industry to use lead-free solders. Solder interconnections serve as electrical connections and also as the mechanical support to hold the IC component in position on the printed circuit board (PCB). It is important to characterize the mechanical properties of lead-free solders. NEMI (National Electronic Manufacturing Initiative) recommends Sn-3.9Ag-0.6Cu(±0.2%) for reflow soldering process and Sn-0.7Cu solder alloy for wave soldering. The scope of this study includes the two NEMI recommended Pb-free solder alloys, namely Sn-3.8Ag-0.7Cu and Sn-0.7Cu. A mechanics of materials characterization of the elastic-plastic-creep properties and low cycle fatigue behavior is reported. A new visco-plastic constitutive model and fatigue model is presented and used to model the thermal fatigue behavior of a Micro-BGA assembly. DOCTOR OF PHILOSOPHY (MAE) 2008-09-17T10:50:12Z 2008-09-17T10:50:12Z 2005 2005 Thesis Xiong, B. S. (2005). Mechanics of materials characterization of lead-free solders. Doctoral thesis, Nanyang Technological University, Singapore. https://hdl.handle.net/10356/5423 10.32657/10356/5423 Nanyang Technological University application/pdf |
| spellingShingle | DRNTU::Engineering::Manufacturing Xiong, Bingshou Mechanics of materials characterization of lead-free solders |
| title | Mechanics of materials characterization of lead-free solders |
| title_full | Mechanics of materials characterization of lead-free solders |
| title_fullStr | Mechanics of materials characterization of lead-free solders |
| title_full_unstemmed | Mechanics of materials characterization of lead-free solders |
| title_short | Mechanics of materials characterization of lead-free solders |
| title_sort | mechanics of materials characterization of lead free solders |
| topic | DRNTU::Engineering::Manufacturing |
| url | https://hdl.handle.net/10356/5423 |
| work_keys_str_mv | AT xiongbingshou mechanicsofmaterialscharacterizationofleadfreesolders |