Variable frequency microwave (VFM) curing for PBGA and FSBGA packages
This paper outlines the technology difference between VFM and conventional curing, the benefits of VFM curing and shares some initial experiences with the Plastic Ball Grid Array and ways to improve the VFM process.
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| Other Authors: | |
| Format: | Thesis |
| Published: |
2008
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| Online Access: | http://hdl.handle.net/10356/5646 |
| _version_ | 1826130146024751104 |
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| author | Chua, Riwis Ian Ping. |
| author2 | Pang, John Hock Lye |
| author_facet | Pang, John Hock Lye Chua, Riwis Ian Ping. |
| author_sort | Chua, Riwis Ian Ping. |
| collection | NTU |
| description | This paper outlines the technology difference between VFM and conventional curing, the benefits of VFM curing and shares some initial experiences with the Plastic Ball Grid Array and ways to improve the VFM process. |
| first_indexed | 2024-10-01T07:51:44Z |
| format | Thesis |
| id | ntu-10356/5646 |
| institution | Nanyang Technological University |
| last_indexed | 2024-10-01T07:51:44Z |
| publishDate | 2008 |
| record_format | dspace |
| spelling | ntu-10356/56462023-03-11T17:20:26Z Variable frequency microwave (VFM) curing for PBGA and FSBGA packages Chua, Riwis Ian Ping. Pang, John Hock Lye School of Mechanical and Production Engineering DRNTU::Engineering::Manufacturing This paper outlines the technology difference between VFM and conventional curing, the benefits of VFM curing and shares some initial experiences with the Plastic Ball Grid Array and ways to improve the VFM process. Master of Science (Mechanics & Processing of Materials) 2008-09-17T10:55:44Z 2008-09-17T10:55:44Z 2002 2002 Thesis http://hdl.handle.net/10356/5646 Nanyang Technological University application/pdf |
| spellingShingle | DRNTU::Engineering::Manufacturing Chua, Riwis Ian Ping. Variable frequency microwave (VFM) curing for PBGA and FSBGA packages |
| title | Variable frequency microwave (VFM) curing for PBGA and FSBGA packages |
| title_full | Variable frequency microwave (VFM) curing for PBGA and FSBGA packages |
| title_fullStr | Variable frequency microwave (VFM) curing for PBGA and FSBGA packages |
| title_full_unstemmed | Variable frequency microwave (VFM) curing for PBGA and FSBGA packages |
| title_short | Variable frequency microwave (VFM) curing for PBGA and FSBGA packages |
| title_sort | variable frequency microwave vfm curing for pbga and fsbga packages |
| topic | DRNTU::Engineering::Manufacturing |
| url | http://hdl.handle.net/10356/5646 |
| work_keys_str_mv | AT chuariwisianping variablefrequencymicrowavevfmcuringforpbgaandfsbgapackages |