Mechanics of thin film adhesion
The aim of this work was to refine the understanding and application of the flat-rectangular-punch (Model I) and axisymmetric-flat-punch (Model II) adhesion test, which were modified and reinforced V-peel and shaft-loaded blister test, respectively.
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| Other Authors: | |
| Format: | Thesis |
| Published: |
2008
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| Online Access: | http://hdl.handle.net/10356/5686 |
| _version_ | 1811677550725824512 |
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| author | Duan, Jin. |
| author2 | School of Mechanical and Production Engineering |
| author_facet | School of Mechanical and Production Engineering Duan, Jin. |
| author_sort | Duan, Jin. |
| collection | NTU |
| description | The aim of this work was to refine the understanding and application of the flat-rectangular-punch (Model I) and axisymmetric-flat-punch (Model II) adhesion test, which were modified and reinforced V-peel and shaft-loaded blister test, respectively. |
| first_indexed | 2024-10-01T02:39:09Z |
| format | Thesis |
| id | ntu-10356/5686 |
| institution | Nanyang Technological University |
| last_indexed | 2024-10-01T02:39:09Z |
| publishDate | 2008 |
| record_format | dspace |
| spelling | ntu-10356/56862023-03-11T17:10:39Z Mechanics of thin film adhesion Duan, Jin. School of Mechanical and Production Engineering DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Thin films The aim of this work was to refine the understanding and application of the flat-rectangular-punch (Model I) and axisymmetric-flat-punch (Model II) adhesion test, which were modified and reinforced V-peel and shaft-loaded blister test, respectively. Master of Engineering (MPE) 2008-09-17T10:56:41Z 2008-09-17T10:56:41Z 2002 2002 Thesis http://hdl.handle.net/10356/5686 Nanyang Technological University application/pdf |
| spellingShingle | DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Thin films Duan, Jin. Mechanics of thin film adhesion |
| title | Mechanics of thin film adhesion |
| title_full | Mechanics of thin film adhesion |
| title_fullStr | Mechanics of thin film adhesion |
| title_full_unstemmed | Mechanics of thin film adhesion |
| title_short | Mechanics of thin film adhesion |
| title_sort | mechanics of thin film adhesion |
| topic | DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Thin films |
| url | http://hdl.handle.net/10356/5686 |
| work_keys_str_mv | AT duanjin mechanicsofthinfilmadhesion |