Optimization of wire bond process for yield improvement with ball grid array
The objective of this project was to improve the process yield of Ball Grid Array (BGA) packages. Preliminary analysis indicated that 42.2% of the yield losses during the wire bonding of BGA packages was due to Non-stick on Pad (NSOP). The main focus of this project was to optimise the processing pa...
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| Format: | Thesis |
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2008
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| Online Access: | http://hdl.handle.net/10356/5710 |
| _version_ | 1811686262384361472 |
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| author | Foo, Chiu Peng. |
| author2 | Lam, Yee Cheong |
| author_facet | Lam, Yee Cheong Foo, Chiu Peng. |
| author_sort | Foo, Chiu Peng. |
| collection | NTU |
| description | The objective of this project was to improve the process yield of Ball Grid Array (BGA) packages. Preliminary analysis indicated that 42.2% of the yield losses during the wire bonding of BGA packages was due to Non-stick on Pad (NSOP). The main focus of this project was to optimise the processing parameters to enhance the adhesion between the ball bond and bond pad, so as to reduce NSOP occurrence. |
| first_indexed | 2024-10-01T04:57:37Z |
| format | Thesis |
| id | ntu-10356/5710 |
| institution | Nanyang Technological University |
| last_indexed | 2024-10-01T04:57:37Z |
| publishDate | 2008 |
| record_format | dspace |
| spelling | ntu-10356/57102023-03-11T17:07:59Z Optimization of wire bond process for yield improvement with ball grid array Foo, Chiu Peng. Lam, Yee Cheong School of Mechanical and Aerospace Engineering Joshi, Sunil Chandrakant DRNTU::Engineering::Manufacturing The objective of this project was to improve the process yield of Ball Grid Array (BGA) packages. Preliminary analysis indicated that 42.2% of the yield losses during the wire bonding of BGA packages was due to Non-stick on Pad (NSOP). The main focus of this project was to optimise the processing parameters to enhance the adhesion between the ball bond and bond pad, so as to reduce NSOP occurrence. Master of Science (Mechanics & Processing of Materials) 2008-09-17T10:57:15Z 2008-09-17T10:57:15Z 2005 2005 Thesis http://hdl.handle.net/10356/5710 Nanyang Technological University application/pdf |
| spellingShingle | DRNTU::Engineering::Manufacturing Foo, Chiu Peng. Optimization of wire bond process for yield improvement with ball grid array |
| title | Optimization of wire bond process for yield improvement with ball grid array |
| title_full | Optimization of wire bond process for yield improvement with ball grid array |
| title_fullStr | Optimization of wire bond process for yield improvement with ball grid array |
| title_full_unstemmed | Optimization of wire bond process for yield improvement with ball grid array |
| title_short | Optimization of wire bond process for yield improvement with ball grid array |
| title_sort | optimization of wire bond process for yield improvement with ball grid array |
| topic | DRNTU::Engineering::Manufacturing |
| url | http://hdl.handle.net/10356/5710 |
| work_keys_str_mv | AT foochiupeng optimizationofwirebondprocessforyieldimprovementwithballgridarray |