Evaluation of electronics materials
This study focused on the modification of Step 2 (Texturing the surface using conventional grit-blasting techniques) of the recycling process. Optical Microscopy study is employed in an attempt to understand and quantify the effect of the resulting microstructure.
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| Other Authors: | |
| Format: | Thesis |
| Published: |
2008
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| Online Access: | http://hdl.handle.net/10356/5749 |
| _version_ | 1826111190858727424 |
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| author | Goh, Kok Hwee. |
| author2 | Wong, Brian Stephen |
| author_facet | Wong, Brian Stephen Goh, Kok Hwee. |
| author_sort | Goh, Kok Hwee. |
| collection | NTU |
| description | This study focused on the modification of Step 2 (Texturing the surface using conventional grit-blasting techniques) of the recycling process. Optical Microscopy study is employed in an attempt to understand and quantify the effect of the resulting microstructure. |
| first_indexed | 2024-10-01T02:46:38Z |
| format | Thesis |
| id | ntu-10356/5749 |
| institution | Nanyang Technological University |
| last_indexed | 2024-10-01T02:46:38Z |
| publishDate | 2008 |
| record_format | dspace |
| spelling | ntu-10356/57492023-03-11T17:18:18Z Evaluation of electronics materials Goh, Kok Hwee. Wong, Brian Stephen School of Mechanical and Production Engineering DRNTU::Engineering::Materials::Electronic packaging materials This study focused on the modification of Step 2 (Texturing the surface using conventional grit-blasting techniques) of the recycling process. Optical Microscopy study is employed in an attempt to understand and quantify the effect of the resulting microstructure. Master of Science (Mechanics & Processing of Materials) 2008-09-17T10:58:08Z 2008-09-17T10:58:08Z 2002 2002 Thesis http://hdl.handle.net/10356/5749 Nanyang Technological University application/pdf |
| spellingShingle | DRNTU::Engineering::Materials::Electronic packaging materials Goh, Kok Hwee. Evaluation of electronics materials |
| title | Evaluation of electronics materials |
| title_full | Evaluation of electronics materials |
| title_fullStr | Evaluation of electronics materials |
| title_full_unstemmed | Evaluation of electronics materials |
| title_short | Evaluation of electronics materials |
| title_sort | evaluation of electronics materials |
| topic | DRNTU::Engineering::Materials::Electronic packaging materials |
| url | http://hdl.handle.net/10356/5749 |
| work_keys_str_mv | AT gohkokhwee evaluationofelectronicsmaterials |