Dynamic characteristics of the wire bonding process in electronic packaging
This thesis describes the work performed to study the dynamic characteristics of the wire bonder, in particular the transducer and bonding process. The effect of polarization in a piezoelectric stack is discussed too. The analysis is also extended to the steady-state response, and discussions and co...
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| Format: | Thesis |
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2008
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| Online Access: | http://hdl.handle.net/10356/5812 |
| _version_ | 1811684052508344320 |
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| author | Hu, Changmin. |
| author2 | Guo, Ningqun |
| author_facet | Guo, Ningqun Hu, Changmin. |
| author_sort | Hu, Changmin. |
| collection | NTU |
| description | This thesis describes the work performed to study the dynamic characteristics of the wire bonder, in particular the transducer and bonding process. The effect of polarization in a piezoelectric stack is discussed too. The analysis is also extended to the steady-state response, and discussions and comparisons are made with respect to the transient response. |
| first_indexed | 2024-10-01T04:22:30Z |
| format | Thesis |
| id | ntu-10356/5812 |
| institution | Nanyang Technological University |
| last_indexed | 2024-10-01T04:22:30Z |
| publishDate | 2008 |
| record_format | dspace |
| spelling | ntu-10356/58122023-03-11T17:09:32Z Dynamic characteristics of the wire bonding process in electronic packaging Hu, Changmin. Guo, Ningqun School of Mechanical and Production Engineering DRNTU::Engineering::Manufacturing This thesis describes the work performed to study the dynamic characteristics of the wire bonder, in particular the transducer and bonding process. The effect of polarization in a piezoelectric stack is discussed too. The analysis is also extended to the steady-state response, and discussions and comparisons are made with respect to the transient response. Doctor of Philosophy (MPE) 2008-09-17T10:59:43Z 2008-09-17T10:59:43Z 2002 2002 Thesis http://hdl.handle.net/10356/5812 Nanyang Technological University application/pdf |
| spellingShingle | DRNTU::Engineering::Manufacturing Hu, Changmin. Dynamic characteristics of the wire bonding process in electronic packaging |
| title | Dynamic characteristics of the wire bonding process in electronic packaging |
| title_full | Dynamic characteristics of the wire bonding process in electronic packaging |
| title_fullStr | Dynamic characteristics of the wire bonding process in electronic packaging |
| title_full_unstemmed | Dynamic characteristics of the wire bonding process in electronic packaging |
| title_short | Dynamic characteristics of the wire bonding process in electronic packaging |
| title_sort | dynamic characteristics of the wire bonding process in electronic packaging |
| topic | DRNTU::Engineering::Manufacturing |
| url | http://hdl.handle.net/10356/5812 |
| work_keys_str_mv | AT huchangmin dynamiccharacteristicsofthewirebondingprocessinelectronicpackaging |