Electrolessly-plated ternary nickel alloys as metallization materials for lead-free soldering
To address the potential reliability challenges brought by the accelerated reaction with the adoption of lead-free solders, three electrolessly-plated ternary Ni-based metallizations (Ni-Sn-P, Ni-W-P and Ni-Co-P) were developed as the soldering metallization in this work. The interfacial reactions b...
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| Format: | Thesis |
| Language: | English |
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2014
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| Online Access: | https://hdl.handle.net/10356/59235 |