Effect of moisture on the curing and processing behaviour of an epoxy underfill system

This project sought to evaluate two cases of water contamination on the processing behaviour and the thermo-mechanical properties of an anhydride cured cycloaliphatic epoxy resin commonly used in underfill formulations. In this study, known amounts of water were deliberately introduced into underfil...

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Bibliographic Details
Main Author: Lim, Sin Heng.
Other Authors: Chian, Kerm Sin
Format: Thesis
Published: 2008
Subjects:
Online Access:http://hdl.handle.net/10356/6027
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author Lim, Sin Heng.
author2 Chian, Kerm Sin
author_facet Chian, Kerm Sin
Lim, Sin Heng.
author_sort Lim, Sin Heng.
collection NTU
description This project sought to evaluate two cases of water contamination on the processing behaviour and the thermo-mechanical properties of an anhydride cured cycloaliphatic epoxy resin commonly used in underfill formulations. In this study, known amounts of water were deliberately introduced into underfill system via two different routes as to simulate two possible ways that water can be introduced to the underfill system, namely (a) during production stage, and (b) during storage and formulation stage. In order to simulate the first case of contamination, water was added directly to the formulated underfill system. As for the second case, water was added directly to the epoxy resin before formulation.
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spelling ntu-10356/60272023-03-11T17:20:49Z Effect of moisture on the curing and processing behaviour of an epoxy underfill system Lim, Sin Heng. Chian, Kerm Sin School of Mechanical and Production Engineering DRNTU::Engineering::Manufacturing This project sought to evaluate two cases of water contamination on the processing behaviour and the thermo-mechanical properties of an anhydride cured cycloaliphatic epoxy resin commonly used in underfill formulations. In this study, known amounts of water were deliberately introduced into underfill system via two different routes as to simulate two possible ways that water can be introduced to the underfill system, namely (a) during production stage, and (b) during storage and formulation stage. In order to simulate the first case of contamination, water was added directly to the formulated underfill system. As for the second case, water was added directly to the epoxy resin before formulation. Master of Engineering (MPE) 2008-09-17T11:05:05Z 2008-09-17T11:05:05Z 2000 2000 Thesis http://hdl.handle.net/10356/6027 Nanyang Technological University application/pdf
spellingShingle DRNTU::Engineering::Manufacturing
Lim, Sin Heng.
Effect of moisture on the curing and processing behaviour of an epoxy underfill system
title Effect of moisture on the curing and processing behaviour of an epoxy underfill system
title_full Effect of moisture on the curing and processing behaviour of an epoxy underfill system
title_fullStr Effect of moisture on the curing and processing behaviour of an epoxy underfill system
title_full_unstemmed Effect of moisture on the curing and processing behaviour of an epoxy underfill system
title_short Effect of moisture on the curing and processing behaviour of an epoxy underfill system
title_sort effect of moisture on the curing and processing behaviour of an epoxy underfill system
topic DRNTU::Engineering::Manufacturing
url http://hdl.handle.net/10356/6027
work_keys_str_mv AT limsinheng effectofmoistureonthecuringandprocessingbehaviourofanepoxyunderfillsystem