Dielectric bonding for semiconductor-on-insulator applications
This report investigates the dielectric bonding between two wafers each comprised of a thin film of Aluminium Nitride (AlN) deposited onto a Si substrate as well as the preparations required to ensure the success of the bonding. The two AlN and Si wafers will be brought together under direct contact...
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| Format: | Final Year Project (FYP) |
| Language: | English |
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2014
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| Online Access: | http://hdl.handle.net/10356/60417 |