Creep deformation of low melting point SN-BI solder alloys by nanoindentation
ABSTRACT Lead-free solders have been used as replacement materials for eutectic tin-lead (Sn-Pb) solder for interconnection in microelectronic devices. Among the available candidates, low melting temperature (Tm¬) lead-free solders have demonstrated their potential as a suitable choice to replace t...
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| Format: | Disertacija |
| Jezik: | English |
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2014
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| Online pristup: | http://hdl.handle.net/10356/60492 |