Creep deformation of low melting point SN-BI solder alloys by nanoindentation

ABSTRACT Lead-free solders have been used as replacement materials for eutectic tin-lead (Sn-Pb) solder for interconnection in microelectronic devices. Among the available candidates, low melting temperature (Tm¬) lead-free solders have demonstrated their potential as a suitable choice to replace t...

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Bibliografski detalji
Glavni autor: Shen, Lu
Daljnji autori: Chen Zhong
Format: Disertacija
Jezik:English
Izdano: 2014
Teme:
Online pristup:http://hdl.handle.net/10356/60492