Optimization of micro hot embossing process for manufacturing polymeric microfluidic devices with aluminum alloy die
This project focuses on optimizing the micro hot embossing process of transferring micro features from an aluminum mold to a polymer substrate of COC with high fidelity. Effects on replication errors of parameters such as embossing temperature, load, holding time, and demolding temperature, were exa...
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| Other Authors: | |
| Format: | Thesis |
| Language: | English |
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2014
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| Online Access: | http://hdl.handle.net/10356/60578 |
| _version_ | 1826113853237231616 |
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| author | Dong, Youqun |
| author2 | Lam Yee Cheong |
| author_facet | Lam Yee Cheong Dong, Youqun |
| author_sort | Dong, Youqun |
| collection | NTU |
| description | This project focuses on optimizing the micro hot embossing process of transferring micro features from an aluminum mold to a polymer substrate of COC with high fidelity. Effects on replication errors of parameters such as embossing temperature, load, holding time, and demolding temperature, were examined by design of experiment, the replication errors during this hot embossing process were modeled by response surface modeling, and optimal hot embossing process conditions were identified by analysis of the developed response surface models. It was found that temperature and load are the two most significant parameters for hot embossing. The orientation of the micro features with respect to the substrate material flow has influence on the width replication of the channels, which suggests that the property of the surface layer of COC substrate is anisotropic. |
| first_indexed | 2024-10-01T03:30:01Z |
| format | Thesis |
| id | ntu-10356/60578 |
| institution | Nanyang Technological University |
| language | English |
| last_indexed | 2024-10-01T03:30:01Z |
| publishDate | 2014 |
| record_format | dspace |
| spelling | ntu-10356/605782020-11-01T11:29:32Z Optimization of micro hot embossing process for manufacturing polymeric microfluidic devices with aluminum alloy die Dong, Youqun Lam Yee Cheong School of Mechanical and Aerospace Engineering Singapore-MIT Alliance Programme DRNTU::Engineering::Manufacturing This project focuses on optimizing the micro hot embossing process of transferring micro features from an aluminum mold to a polymer substrate of COC with high fidelity. Effects on replication errors of parameters such as embossing temperature, load, holding time, and demolding temperature, were examined by design of experiment, the replication errors during this hot embossing process were modeled by response surface modeling, and optimal hot embossing process conditions were identified by analysis of the developed response surface models. It was found that temperature and load are the two most significant parameters for hot embossing. The orientation of the micro features with respect to the substrate material flow has influence on the width replication of the channels, which suggests that the property of the surface layer of COC substrate is anisotropic. Master of Science (IMST) 2014-05-28T08:15:33Z 2014-05-28T08:15:33Z 2009 2009 Thesis http://hdl.handle.net/10356/60578 en 69 p. application/pdf |
| spellingShingle | DRNTU::Engineering::Manufacturing Dong, Youqun Optimization of micro hot embossing process for manufacturing polymeric microfluidic devices with aluminum alloy die |
| title | Optimization of micro hot embossing process for manufacturing polymeric microfluidic devices with aluminum alloy die |
| title_full | Optimization of micro hot embossing process for manufacturing polymeric microfluidic devices with aluminum alloy die |
| title_fullStr | Optimization of micro hot embossing process for manufacturing polymeric microfluidic devices with aluminum alloy die |
| title_full_unstemmed | Optimization of micro hot embossing process for manufacturing polymeric microfluidic devices with aluminum alloy die |
| title_short | Optimization of micro hot embossing process for manufacturing polymeric microfluidic devices with aluminum alloy die |
| title_sort | optimization of micro hot embossing process for manufacturing polymeric microfluidic devices with aluminum alloy die |
| topic | DRNTU::Engineering::Manufacturing |
| url | http://hdl.handle.net/10356/60578 |
| work_keys_str_mv | AT dongyouqun optimizationofmicrohotembossingprocessformanufacturingpolymericmicrofluidicdeviceswithaluminumalloydie |