Integrated circuit radiated emissions
The objective of this project is to measure radiated emission of integrated circuit (IC) by a test jig and field scanner. The test jig that will be set up for this project would be a closed Transverse Electro-Magnetic (TEM) cell. Using the TEM cell radiated emission of the IC-under-test will be meas...
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| Other Authors: | |
| Format: | Final Year Project (FYP) |
| Language: | English |
| Published: |
2014
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| Subjects: | |
| Online Access: | http://hdl.handle.net/10356/60854 |
| _version_ | 1824454643312230400 |
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| author | Lim, Jian Xin |
| author2 | See Kye Yak |
| author_facet | See Kye Yak Lim, Jian Xin |
| author_sort | Lim, Jian Xin |
| collection | NTU |
| description | The objective of this project is to measure radiated emission of integrated circuit (IC) by a test jig and field scanner. The test jig that will be set up for this project would be a closed Transverse Electro-Magnetic (TEM) cell. Using the TEM cell radiated emission of the IC-under-test will be measured. The IC-under-test will also undergo measurement using near field scanner. Comprehensive analysis will be carried out to co-relate the result from the TEM cell and the scanner. |
| first_indexed | 2025-02-19T03:25:34Z |
| format | Final Year Project (FYP) |
| id | ntu-10356/60854 |
| institution | Nanyang Technological University |
| language | English |
| last_indexed | 2025-02-19T03:25:34Z |
| publishDate | 2014 |
| record_format | dspace |
| spelling | ntu-10356/608542023-07-07T16:03:32Z Integrated circuit radiated emissions Lim, Jian Xin See Kye Yak School of Electrical and Electronic Engineering DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging The objective of this project is to measure radiated emission of integrated circuit (IC) by a test jig and field scanner. The test jig that will be set up for this project would be a closed Transverse Electro-Magnetic (TEM) cell. Using the TEM cell radiated emission of the IC-under-test will be measured. The IC-under-test will also undergo measurement using near field scanner. Comprehensive analysis will be carried out to co-relate the result from the TEM cell and the scanner. Bachelor of Engineering 2014-06-02T03:39:02Z 2014-06-02T03:39:02Z 2014 2014 Final Year Project (FYP) http://hdl.handle.net/10356/60854 en Nanyang Technological University 50 p. application/pdf |
| spellingShingle | DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging Lim, Jian Xin Integrated circuit radiated emissions |
| title | Integrated circuit radiated emissions |
| title_full | Integrated circuit radiated emissions |
| title_fullStr | Integrated circuit radiated emissions |
| title_full_unstemmed | Integrated circuit radiated emissions |
| title_short | Integrated circuit radiated emissions |
| title_sort | integrated circuit radiated emissions |
| topic | DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging |
| url | http://hdl.handle.net/10356/60854 |
| work_keys_str_mv | AT limjianxin integratedcircuitradiatedemissions |