Study of pool boiling enhancement structures and development of two phase cooling solution for electronics package
Advances in microelectronics design and manufacturing made possibe higher transistor density in a single device. IC chips are now being stacked vertically for better electrical performance and compact system design, which leads to high heat flux in the order of 50W/cm2. Air cooling has poor cooli...
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| Format: | Thesis |
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2008
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| Online Access: | https://hdl.handle.net/10356/6248 |
| _version_ | 1826128055169449984 |
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| author | Oratti Kalandar Navas Khan |
| author2 | D. Pinjala |
| author_facet | D. Pinjala Oratti Kalandar Navas Khan |
| author_sort | Oratti Kalandar Navas Khan |
| collection | NTU |
| description | Advances in microelectronics design and manufacturing made possibe higher transistor density in a single device. IC chips are now being stacked vertically for better electrical performance and compact system design, which leads to high heat flux in the order of 50W/cm2. Air cooling has poor cooling efficiency for high power application, therefore liquid cooling /boiling heat transfer is preferred due its high heat removal capabilities. Pool boiling heat transfer is investigated for electonic cooling in this research with the target to achive 50W/cm2. |
| first_indexed | 2024-10-01T07:18:37Z |
| format | Thesis |
| id | ntu-10356/6248 |
| institution | Nanyang Technological University |
| last_indexed | 2024-10-01T07:18:37Z |
| publishDate | 2008 |
| record_format | dspace |
| spelling | ntu-10356/62482023-03-11T17:24:18Z Study of pool boiling enhancement structures and development of two phase cooling solution for electronics package Oratti Kalandar Navas Khan D. Pinjala Toh Kok Chuan School of Mechanical and Aerospace Engineering DRNTU::Engineering::Mechanical engineering Advances in microelectronics design and manufacturing made possibe higher transistor density in a single device. IC chips are now being stacked vertically for better electrical performance and compact system design, which leads to high heat flux in the order of 50W/cm2. Air cooling has poor cooling efficiency for high power application, therefore liquid cooling /boiling heat transfer is preferred due its high heat removal capabilities. Pool boiling heat transfer is investigated for electonic cooling in this research with the target to achive 50W/cm2. MASTER OF ENGINEERING (MPE) 2008-09-17T11:10:15Z 2008-09-17T11:10:15Z 2006 2006 Thesis Oratti Kalandar Navas Khan. (2006). Study of pool boiling enhancement structures and development of two phase cooling solution for electronics package. Master’s thesis, Nanyang Technological University, Singapore. https://hdl.handle.net/10356/6248 10.32657/10356/6248 Nanyang Technological University application/pdf |
| spellingShingle | DRNTU::Engineering::Mechanical engineering Oratti Kalandar Navas Khan Study of pool boiling enhancement structures and development of two phase cooling solution for electronics package |
| title | Study of pool boiling enhancement structures and development of two phase cooling solution for electronics package |
| title_full | Study of pool boiling enhancement structures and development of two phase cooling solution for electronics package |
| title_fullStr | Study of pool boiling enhancement structures and development of two phase cooling solution for electronics package |
| title_full_unstemmed | Study of pool boiling enhancement structures and development of two phase cooling solution for electronics package |
| title_short | Study of pool boiling enhancement structures and development of two phase cooling solution for electronics package |
| title_sort | study of pool boiling enhancement structures and development of two phase cooling solution for electronics package |
| topic | DRNTU::Engineering::Mechanical engineering |
| url | https://hdl.handle.net/10356/6248 |
| work_keys_str_mv | AT orattikalandarnavaskhan studyofpoolboilingenhancementstructuresanddevelopmentoftwophasecoolingsolutionforelectronicspackage |