Study of pool boiling enhancement structures and development of two phase cooling solution for electronics package
Advances in microelectronics design and manufacturing made possibe higher transistor density in a single device. IC chips are now being stacked vertically for better electrical performance and compact system design, which leads to high heat flux in the order of 50W/cm2. Air cooling has poor cooli...
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| Format: | Thesis |
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2008
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| Online Access: | https://hdl.handle.net/10356/6248 |