Development of simulation programs for heat transfer
This project is about several simulation programs for heat transfer. Heat transfer is an important subject for many field of engineering, such as Mechanical Engineering, Electrical Engineering, Electronic Engineering and so on. This article mainly included 5 parts. The first part introduced the basi...
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| Other Authors: | |
| Format: | Final Year Project (FYP) |
| Language: | English |
| Published: |
2015
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| Online Access: | http://hdl.handle.net/10356/63834 |
| _version_ | 1811681588466941952 |
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| author | Yang, Zhuang |
| author2 | Tan Eng Leong |
| author_facet | Tan Eng Leong Yang, Zhuang |
| author_sort | Yang, Zhuang |
| collection | NTU |
| description | This project is about several simulation programs for heat transfer. Heat transfer is an important subject for many field of engineering, such as Mechanical Engineering, Electrical Engineering, Electronic Engineering and so on. This article mainly included 5 parts. The first part introduced the basic mode of heat transfer, analytical method, simulation and numerical methods. Secondly, in chapter 3, uses control volume or finite-difference method to explain numerical solution of heat conduction and uses C-language to program for a problem. Thirdly, in chapter 4, did simulations by MATLAB and comparison of the heat transfer for graphene, gold, and ferrum to verify their heat-conducting property. Then, chapter 5 introduced the method of PCB modeling and numerical solution of temperature field of PCB. Last part, did simulations by MATLAB to study effects of components layout on PCB heat dissipation and the time length of PCB reached steady condition. This would help PCB manufactures improve the performance of PCB from the layout of components and set the way of heat dissipation. |
| first_indexed | 2024-10-01T03:43:20Z |
| format | Final Year Project (FYP) |
| id | ntu-10356/63834 |
| institution | Nanyang Technological University |
| language | English |
| last_indexed | 2024-10-01T03:43:20Z |
| publishDate | 2015 |
| record_format | dspace |
| spelling | ntu-10356/638342023-07-07T16:47:17Z Development of simulation programs for heat transfer Yang, Zhuang Tan Eng Leong School of Electrical and Electronic Engineering DRNTU::Engineering::Electrical and electronic engineering::Electric apparatus and materials This project is about several simulation programs for heat transfer. Heat transfer is an important subject for many field of engineering, such as Mechanical Engineering, Electrical Engineering, Electronic Engineering and so on. This article mainly included 5 parts. The first part introduced the basic mode of heat transfer, analytical method, simulation and numerical methods. Secondly, in chapter 3, uses control volume or finite-difference method to explain numerical solution of heat conduction and uses C-language to program for a problem. Thirdly, in chapter 4, did simulations by MATLAB and comparison of the heat transfer for graphene, gold, and ferrum to verify their heat-conducting property. Then, chapter 5 introduced the method of PCB modeling and numerical solution of temperature field of PCB. Last part, did simulations by MATLAB to study effects of components layout on PCB heat dissipation and the time length of PCB reached steady condition. This would help PCB manufactures improve the performance of PCB from the layout of components and set the way of heat dissipation. Bachelor of Engineering 2015-05-19T06:18:21Z 2015-05-19T06:18:21Z 2015 2015 Final Year Project (FYP) http://hdl.handle.net/10356/63834 en Nanyang Technological University 68 p. application/pdf |
| spellingShingle | DRNTU::Engineering::Electrical and electronic engineering::Electric apparatus and materials Yang, Zhuang Development of simulation programs for heat transfer |
| title | Development of simulation programs for heat transfer |
| title_full | Development of simulation programs for heat transfer |
| title_fullStr | Development of simulation programs for heat transfer |
| title_full_unstemmed | Development of simulation programs for heat transfer |
| title_short | Development of simulation programs for heat transfer |
| title_sort | development of simulation programs for heat transfer |
| topic | DRNTU::Engineering::Electrical and electronic engineering::Electric apparatus and materials |
| url | http://hdl.handle.net/10356/63834 |
| work_keys_str_mv | AT yangzhuang developmentofsimulationprogramsforheattransfer |