Study on the application of multiple line laser to perform BGA package ball inspection

Study on the application of multiple line laser to perform BGA package ball inspection

Study on the application of Phase Shift Interferometery on a Ball Grid Array (BGA) package for solder ball inspection.

Bibliographic Details
Main Author:	Tan, Chun Seng.
Other Authors:	Asundi, Anand Krishna
Format:	Thesis
Published:	2008
Subjects:	DRNTU::Engineering::Manufacturing
Online Access:	http://hdl.handle.net/10356/6441

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