Development of high strength gold bonding wires for fine pitch wire bonding process
This project focused on the development of new gold bonding wires, which has high modulus and break load. Various combinations of alloying elements were used to dope the pure gold forming different alloys. The mechanical properties including break load at certain elongation level and elastic modulus...
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| Format: | Thesis |
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2008
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| Online Access: | http://hdl.handle.net/10356/6450 |
| _version_ | 1811684156529180672 |
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| author | Dong, Albert Renjun |
| author2 | School of Mechanical and Production Engineering |
| author_facet | School of Mechanical and Production Engineering Dong, Albert Renjun |
| author_sort | Dong, Albert Renjun |
| collection | NTU |
| description | This project focused on the development of new gold bonding wires, which has high modulus and break load. Various combinations of alloying elements were used to dope the pure gold forming different alloys. The mechanical properties including break load at certain elongation level and elastic modulus were used to determine the effectiveness of alloy strengthening element. It was found that Beryllium, and Calcium have most strengthening effect at low concentration level while Platinum and Copper have very good strengthening effect at high concentration level. |
| first_indexed | 2024-10-01T04:24:09Z |
| format | Thesis |
| id | ntu-10356/6450 |
| institution | Nanyang Technological University |
| last_indexed | 2024-10-01T04:24:09Z |
| publishDate | 2008 |
| record_format | dspace |
| spelling | ntu-10356/64502023-03-11T17:11:19Z Development of high strength gold bonding wires for fine pitch wire bonding process Dong, Albert Renjun School of Mechanical and Production Engineering DRNTU::Engineering::Manufacturing This project focused on the development of new gold bonding wires, which has high modulus and break load. Various combinations of alloying elements were used to dope the pure gold forming different alloys. The mechanical properties including break load at certain elongation level and elastic modulus were used to determine the effectiveness of alloy strengthening element. It was found that Beryllium, and Calcium have most strengthening effect at low concentration level while Platinum and Copper have very good strengthening effect at high concentration level. Master of Science 2008-09-17T11:15:16Z 2008-09-17T11:15:16Z 2000 2000 Thesis http://hdl.handle.net/10356/6450 Nanyang Technological University application/pdf |
| spellingShingle | DRNTU::Engineering::Manufacturing Dong, Albert Renjun Development of high strength gold bonding wires for fine pitch wire bonding process |
| title | Development of high strength gold bonding wires for fine pitch wire bonding process |
| title_full | Development of high strength gold bonding wires for fine pitch wire bonding process |
| title_fullStr | Development of high strength gold bonding wires for fine pitch wire bonding process |
| title_full_unstemmed | Development of high strength gold bonding wires for fine pitch wire bonding process |
| title_short | Development of high strength gold bonding wires for fine pitch wire bonding process |
| title_sort | development of high strength gold bonding wires for fine pitch wire bonding process |
| topic | DRNTU::Engineering::Manufacturing |
| url | http://hdl.handle.net/10356/6450 |
| work_keys_str_mv | AT dongalbertrenjun developmentofhighstrengthgoldbondingwiresforfinepitchwirebondingprocess |