Characterisation of the temperature and time dependent mechanical properties and solder
Eutectic 63Sn-37Pb solder is commonly used as interconnects in SMT electronic packages. Characterisation of the temperature and time dependent properties of eutectic solder is necessary in understanding solder joint reliability. The effect of thermal cycling ageing on solder joint mechanical propert...
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| Format: | Thesis |
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2008
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| Online adgang: | http://hdl.handle.net/10356/6475 |
| _version_ | 1826127191406018560 |
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| author | Tan, Kwang Hong. |
| author2 | Pang, John Hock Lye |
| author_facet | Pang, John Hock Lye Tan, Kwang Hong. |
| author_sort | Tan, Kwang Hong. |
| collection | NTU |
| description | Eutectic 63Sn-37Pb solder is commonly used as interconnects in SMT electronic packages. Characterisation of the temperature and time dependent properties of eutectic solder is necessary in understanding solder joint reliability. The effect of thermal cycling ageing on solder joint mechanical properties and residual fatigue strength requires research attention. This report documents the investigation conducted on the determination of the mechanical properties of bulk solder specimens, the microstructural and mechanical response of solder after subjecting reflowed solder joint to thermal cycling ageing from -40°C to 125°C. |
| first_indexed | 2024-10-01T07:04:45Z |
| format | Thesis |
| id | ntu-10356/6475 |
| institution | Nanyang Technological University |
| last_indexed | 2024-10-01T07:04:45Z |
| publishDate | 2008 |
| record_format | dspace |
| spelling | ntu-10356/64752023-03-11T17:27:20Z Characterisation of the temperature and time dependent mechanical properties and solder Tan, Kwang Hong. Pang, John Hock Lye School of Mechanical and Production Engineering DRNTU::Engineering::Manufacturing Eutectic 63Sn-37Pb solder is commonly used as interconnects in SMT electronic packages. Characterisation of the temperature and time dependent properties of eutectic solder is necessary in understanding solder joint reliability. The effect of thermal cycling ageing on solder joint mechanical properties and residual fatigue strength requires research attention. This report documents the investigation conducted on the determination of the mechanical properties of bulk solder specimens, the microstructural and mechanical response of solder after subjecting reflowed solder joint to thermal cycling ageing from -40°C to 125°C. Master of Engineering (MPE) 2008-09-17T11:15:57Z 2008-09-17T11:15:57Z 2000 2000 Thesis http://hdl.handle.net/10356/6475 Nanyang Technological University application/pdf |
| spellingShingle | DRNTU::Engineering::Manufacturing Tan, Kwang Hong. Characterisation of the temperature and time dependent mechanical properties and solder |
| title | Characterisation of the temperature and time dependent mechanical properties and solder |
| title_full | Characterisation of the temperature and time dependent mechanical properties and solder |
| title_fullStr | Characterisation of the temperature and time dependent mechanical properties and solder |
| title_full_unstemmed | Characterisation of the temperature and time dependent mechanical properties and solder |
| title_short | Characterisation of the temperature and time dependent mechanical properties and solder |
| title_sort | characterisation of the temperature and time dependent mechanical properties and solder |
| topic | DRNTU::Engineering::Manufacturing |
| url | http://hdl.handle.net/10356/6475 |
| work_keys_str_mv | AT tankwanghong characterisationofthetemperatureandtimedependentmechanicalpropertiesandsolder |