Characterisation of the temperature and time dependent mechanical properties and solder

Characterisation of the temperature and time dependent mechanical properties and solder

Eutectic 63Sn-37Pb solder is commonly used as interconnects in SMT electronic packages. Characterisation of the temperature and time dependent properties of eutectic solder is necessary in understanding solder joint reliability. The effect of thermal cycling ageing on solder joint mechanical propert...

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Bibliografiske detaljer
Hovedforfatter:	Tan, Kwang Hong.
Andre forfattere:	Pang, John Hock Lye
Format:	Thesis
Udgivet:	2008
Fag:	DRNTU::Engineering::Manufacturing
Online adgang:	http://hdl.handle.net/10356/6475

Lignende værker

Mechanics of materials characterization of lead-free solders
af: Xiong, Bingshou
Udgivet: (2008)

Analysis of temperature profile on a PCB in the preheat section of a wave soldering process
af: Hoe, Swee Long.
Udgivet: (2008)

Thermo-mechanical reliability analysis of solder joints in surface mounted printed circuit board assemblies
af: Ang, Kar Hwee
Udgivet: (2008)

Process and reliability studies of solder bumping using eutectic sn/pb solder
af: Lo, Marvin Chen Yang.
Udgivet: (2008)

Study on the interconnection failure in lead-free soldered assemblies
af: Xu, Luhua
Udgivet: (2008)

Nanoindentation and strain rate effects on hardness of solder materials
af: Toh, Jyh Terng.
Udgivet: (2009)

Study of solder joints for ball grid array (BGA) assembly
af: Yam, Shong Wai
Udgivet: (2008)

Reliability analysis of surface mount solder joints
af: Yeo, Chee Keng.
Udgivet: (2009)

Selective laser melting of aluminium alloys : numerical modelling and material properties characterisation
af: Loh, Loong Ee
Udgivet: (2015)

Characterisation and modeling of chemical mechanical planarization (CMP) for deep submicron integrated circuit (IC) fabrication
af: Wang, Sim Kit
Udgivet: (2010)

High temperature lead free solder
af: Song, Glenn Qi Xuan
Udgivet: (2017)

System design and characterisation of integrated liquid cooling solutions for 3D-stacked modules
af: Tan, Siow Pin
Udgivet: (2009)

Characterisation of thermosonic applications in wire bonding
af: Moey, Chin Hui.
Udgivet: (2008)

Ultrasonic characterisation of interfaces in IC packaging
af: Wang, Yi
Udgivet: (2008)

Electrical properties of AU-GE solder under high temperature
af: Lau, Fu Long
Udgivet: (2014)

Application of the surface characterisation techniques to the grinding process
af: Mohd Mazuan Mansor.
Udgivet: (2009)

Lead-free PCB assembly and effect of solder joint profile on the reliability of PCB assembly
af: Periannan Arulvanan.
Udgivet: (2008)

A review: effect of copper percentage solder alloy after laser soldering
af: Asyraf, Abdullah, et al.
Udgivet: (2023)

Study of microstructures and mechanical properties of lead-free solder joints
af: Ngoh, Shwu Lan
Udgivet: (2010)

The optimisation of turning through topographic characterisation
af: Mattathil Chacko Varkey Mathai.
Udgivet: (2008)

The multiple temperature heater platforms for solder Electromigration test conducted at room temperature
af: Hou, Yuejin, et al.
Udgivet: (2010)

Effect of Sn-xCu Solder Alloy onto Intermetallic Formation After Laser Soldering
af: Muhammad Asyraf, Abdullah, et al.
Udgivet: (2023)

Mechanical properties of metal injection molding (MIM) parts
af: Ji, Chun Hai
Udgivet: (2008)

Mechanical properties of metal injection molding (MIM) parts
af: Ji, Chun Hai
Udgivet: (2008)

Morphological and mechanical characterisation of BI-AG alloy as high temperature lead free solder
af: Nahavandi, Mahdi
Udgivet: (2014)

Fabrication and characterisation of MWNT resistive type gas sensor
af: Gnanavelu Arulmurugan.
Udgivet: (2010)

Preparation of autoclaved aerated concrete with mechanically or physically sound properties
af: Garg Arjun
Udgivet: (2015)

Fabrication and characterisation of carbon fiber and CNT reinforced aluminium matrix composites
af: Rengarajan Karthic Narayanan.
Udgivet: (2010)

Thermo-mechanical and fatigue behaviors of solder joints
af: Luo, Guangxing.
Udgivet: (2008)

Mechanics of solder joints and solder / intermetallic interface under temperature and mechanical loading /
af: 401100 Fethma M. Nor, et al.
Udgivet: (2009)

The effects of adding silver and indium to lead-free solders
af: Dharma, I.G.B., et al.
Udgivet: (2009)

Critical temperatures of superconducting solders
af: Pavão, Erica Medeiros
Udgivet: (2008)

Scheduling manufacturing system with sequence dependent setup and maintenance
af: Hendra Teja Wirawan
Udgivet: (2015)

Properties Of Low Temperature Indium-Based Ternary Lead Free Solders System [TS610. S165 2008 f rb].
af: Jahari, Mohamad Salimin
Udgivet: (2008)

Design and development of a real time thermal growth and temperature measurement system for the CNC vertical machining center
af: Rangarajan Sivakumar
Udgivet: (2008)

Prediction of temperature offsets in the epitaxy process
af: Yang, Xuan Wei
Udgivet: (2010)

Development of fabrication process for embedded structure in multi-layer low temperature co-fired ceramics (LTCC) using sacrificial carbon by process modelling and simulation
af: Tan, Yeow Meng
Udgivet: (2013)

Characterisation of Titanium Foams Sintered at Different Temperatures Prepared by the Slurry Method
af: Ahmad, Sufizar, et al.
Udgivet: (2010)

Interfacial reactions during soldering of Sn-Ag-Cu lead free solders on immersion silver and electroless nickel/ immersion gold surface finishes
af: Idris, Siti Rabiatull Aisha
Udgivet: (2008)

Wettability of low silver content lead-free solder alloy
af: Dharma, I., et al.
Udgivet: (2009)