Automated wafer management system
The purpose of this report is to details the function and reliability test done to the Automated Wafer Management System. The results of these tests will determine the system reliability and whether given functionality works as specified. The anticipated outcome of these tests is to identify the pro...
Main Author: | Lim, Kai Yi |
---|---|
Other Authors: | K Radhakrishnan |
Format: | Final Year Project (FYP) |
Language: | English |
Published: |
2015
|
Subjects: | |
Online Access: | http://hdl.handle.net/10356/65808 |
Similar Items
-
Wafer fabrication cycle time report
by: Cheng, Hao Fen.
Published: (2013) -
Characteristics of chemical mechanical polishing in advanced wafer processing
by: Huang, Wen Ke.
Published: (2008) -
Study of low temperature plasma activated wafer bonding
by: Yeo, Thomas Peng Siong.
Published: (2013) -
Wafer-scale deposition of transition metal Dichalcogenide film
by: Ang, Nicole Ru Xuan
Published: (2022) -
Study on the semiconductor wafer fabrication performance improvement based on job release control
by: Andy Darwin Kasan Hidayat
Published: (2008)